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首页> 外文期刊>Powder Metallurgy >Ultrafine-grained W-Cu-SiC composites prepared by mechanical alloying and infiltration of copper into pre-sintered skeleton
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Ultrafine-grained W-Cu-SiC composites prepared by mechanical alloying and infiltration of copper into pre-sintered skeleton

机译：通过机械合金化和铜的渗透到预烧结骨架中制备超细晶粒晶的W-Cu-SiC复合材料

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摘要

In this paper, a combined processing method of mechanical alloying and infiltration was used to prepare the WCu-xwt-%SiC (x = 0.5, 1, 2, 3) composites. The microstructure, density, electrical conductivity and compressive behaviour of the composites were studied comparatively. First a decreasing and then an increasing particle growth trend was obtained, indicating that a small content of SiC below 1 wt-% was beneficial for particle refinement. Besides this, with the increase of the SiC content, both the density and electrical conductivity decreased gradually. Consistent with the particle-particle contiguity of the highest value of 0.404, the WCu-1 wt-%SiC composite showed the best compressive properties. Further electron backscattering diffraction results revealed that the ultrafine-grained SiC particles, which are distributed homogeneously in the composite with lower Schmid factor values would perturb the dislocation motion to make proliferation of more dislocations, exhibiting unordinary strain-hardening during deformation.
机译：本文采用了机械合金化和渗透的组合处理方法，制备WCU-XWT-％SiC（x = 0.5,1,2,3）复合材料。相对研究了复合材料的微观结构，密度，导电性和压缩性能。首先获得逐渐减少，然后获得增加的粒子生长趋势，表明SiC的少量含量低于1wt-％是有益的颗粒细化。除此之外，随着SIC含量的增加，密度和电导率均逐渐降低。与最高值为0.404的粒子颗粒恒定，WCU-1重量％SiC复合材料一致地显示出最佳的压缩性能。进一步的电子反向散射衍射结果显示，超细晶粒颗粒，其在具有较低的施突因子值的复合材料中均匀分布将使位错动作产生更多位错，在变形期间表现出非负载性硬化。

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