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Preparation and thermal stability of heat-resistant phenolic resin system constructed by multiple heat-resistant compositions containing boron and silicon

机译:由含硼和硅构造的多种耐热组合物构成的耐热酚醛树脂系统的制备及热稳定性

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摘要

This work reports a boron- and silicon-containing phenolic-formaldehyde (PF) resin exhibiting an extremely high thermal decomposition temperature and char yield and formed by copolymerizing phenol, formaldehyde, boric acid (BA), and phenyltriethoxysilane (PTES). The structure of BA and PTES-modified PF (BSPF) resin was characterized by Fourier transform infrared spectroscopy. Thermal stability of the investigated composites was estimated by means of thermogravimetric analysis (TGA). The results of TGA indicated that the modified resin exhibited excellent thermal stability. Specifically, the thermoset had a char yield of 77.0% when the boron and silicon contents were only 1.27 wt% and 1.7 wt%, respectively. Compared with the unmodified resin (PF), the temperature at the maximum decomposing rate of the BSPF increased by 84 degrees C and its charring yield was enhanced by 15.0%. The cured products of PF and BSPF were further investigated by X-ray diffraction and Raman spectroscopy, respectively. The incorporation of boron and silicon into the carbon lattice results in a decrease of interlayer spacing, and Raman I-D/I-G values for PF and BSPF (2.63 and 1.32) show that the rearrangement of crystalline structure leads to an increase in graphite structure and a decrease in disordered structure upon the modification processes.
机译:该工作报告了含硼和含硅酚醛 - 甲醛(PF)树脂,其具有极高的热分解温度和炭产率,并通过共聚酚,甲醛,硼酸(BA)和苯基三氧基硅烷(PTE)形成。 BA和PTES改性的PF(BSPF)树脂的结构特征在于傅里叶变换红外光谱。通过热重分析估计研究复合材料的热稳定性(TGA)。 TGA的结果表明,改性树脂表现出优异的热稳定性。具体而言,当硼和硅含量仅为1.27wt%和1.7wt%时,热固性热量的炭产率为77.0%。与未改性树脂(PF)相比,BSPF的最大分解率的温度增加了84℃,其炭化产率提高了15.0%。通过X射线衍射和拉曼光谱进一步研究了PF和BSPF的固化产物。将硼和硅掺入碳晶格中导致中间间距的降低,并且PF和BSPF(2.63和1.32)的拉曼ID / Ig值表明,结晶结构的重排导致石墨结构的增加和减少在修改过程时在混乱的结构中。

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