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首页> 外文期刊>Heat Transfer Research >HEAT AND MASS TRANSFER BOUNDARY-LAYER FLOW OVER A VERTICAL CONE THROUGH POROUS MEDIA FILLED WITH A Cu–WATER AND Ag–WATER NANOFLUID
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HEAT AND MASS TRANSFER BOUNDARY-LAYER FLOW OVER A VERTICAL CONE THROUGH POROUS MEDIA FILLED WITH A Cu–WATER AND Ag–WATER NANOFLUID

机译：通过填充用Cu水和Ag水纳米流体的多孔介质，热和传质边界层流过垂直锥体

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摘要

In this paper, we have described the influence of thermal radiation and chemical reaction on boundary-layer flow, heat and mass transfer of two different nanofluids in a porous medium over a vertical cone with heat generation/absorption. In the present study, we have considered two varieties of nanofluids, namely, Cu–water and Ag–water nanofluids (with volume fraction 10% and 30%). The similarity variables are used to transform conservation equations for the nanofluid into a set of ordinary differential equations and are solved numerically subject to the boundary conditions using well-organized, extensively authorized, variational finite element method. The correctness of the present numerical code is validated with previously published data, and the results are found to be in good agreement. The sway of important nondimensional parameters of velocity, temperature, and nanoparticle concentration fields as well as the skin friction coefficient, Nusselt number, and Sherwood number are examined in detail, and the results are shown graphically and in a tabular form to illustrate the physical importance of the problem. The thermal boundary-layer thickness is raised in the entire flow region as the volume fraction of nanoparticles increased from 10% to 30%, and this rise in the temperature profiles is more in the Ag–water nanofluid than in the Cu–water nanofluid.
机译：在本文中，我们已经描述了热辐射和化学反应对具有发热/吸收的垂直锥在多孔介质中两种不同纳米流体的边界层流动，热量和传质。在本研究中，我们考虑了两种纳米流体，即Cu水和Ag水纳米流体（体积级分10％和30％）。相似变量用于将纳米流体的节约方程转换为一组常微分方程，并且使用良好组织的广泛授权的变分有限元方法在数字上以数字地解决边界条件。使用先前发布的数据验证了当前数值代码的正确性，结果将符合良好的协议。详细研究了速度，温度和纳米粒子浓度场的重要非尺寸参数以及皮肤摩擦系数，露珠数和舍伍德数的摇摆，结果以图形方式显示，并以表格形式示出了物理重要性问题。随着纳米颗粒的体积分数从10％增加到30％，在整个流动区域中升高了热边界层厚度，并且温度型材的升高比在Cu水纳米流体中更多的温度型材更加升高。

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