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Investigations on Short-Circuit Power Dissipation in Repeater Loaded VLSI Interconnects

机译:转发器中的短路功耗的调查加载了VLSI互连

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摘要

Short-circuit power dissipations in CMOS repeater driven VLSI interconnects are analyzed. Both resistive (RC) and inductive (RLC) interconnect models are treated. Analytical methods to calculate short-circuit power is proposed. Good agreement between analytical and SPICE simulated results are obtained. Analytical error less than 10% is achieved. Analysis shows Short-circuit power increases with increase in interconnect resistance, inductance and capacitance. It also increases with increase in number of repeaters.
机译:分析了CMOS中继器的短路功耗驱动VLSI互连。 处理电阻(RC)和电感(RLC)互连模型。 提出了计算短路功率的分析方法。 获得了分析和Spice模拟结果之间的良好一致性。 实现了小于10%的分析误差。 分析显示短路功率随着互连电阻,电感和电容的增加而增加。 它也随着中继器数量的增加而增加。

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