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首页> 外文期刊>Journal of Materials Engineering and Performance >Effect of Sodium Dodecyl Sulfate on Mechanical Properties and Electrical Conductivity of Nanotwinned Copper
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Effect of Sodium Dodecyl Sulfate on Mechanical Properties and Electrical Conductivity of Nanotwinned Copper

机译：十二烷基硫酸钠对纳米纤维铜力学性能和电导率的影响

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摘要

A compound additive, gelatin (G) + sodium dodecyl sulfate (SDS), was firstly proposed to synthesize nanotwinned Cu with enhanced mechanical properties and electrical conductivity by direct current (DC) electrodeposition. The effect of compound additive in acid copper plating electrolyte on microstructure, nanoindentation hardness, tensile properties and electrical conductivity of electrodeposited copper was investigated. The optimum conditions of DC electrodeposition and deposition rate of electrodeposited copper were evaluated. The results show that the formation of nanotwins and the refinement of grains were enhanced after adding the 20 mg/L SDS + 15 mg/L G of compound additive, in return, which has a positive contribution to the enhanced mechanical properties and electrical conductivity. Tensile strength, hardness and the elongation to failure of electrodeposited Cu were 490 MPa, 1.79 GPa and 7.1%, respectively. The electrical conductivity was 97.4% IACS at room temperature. The enhancement mechanism of tensile properties and electrical conductivity was explained in view of high density of nanotwins.
机译：首先提出了一种复合添加剂，明胶（G）硫酸钠（SDS），以通过直流（DC）电沉积，通过增强的机械性能和电导率合成纳米丝Cu。研究了化合物添加剂在酸铜电镀电解质对微结构，纳米狭窄硬度，拉伸性能和电沉积铜电导率的影响。评估了直流电沉积和电沉积铜的沉积速率的最佳条件。结果表明，在加入20mg / L SDS + 15mg / L G复合添加剂后，增强了纳米管的形成和晶粒的细化，其返回，其对增强的机械性能和导电性具有阳性贡献。电沉积Cu的拉伸强度，硬度和伸长率分别为490MPa，1.79GPa和7.1％。在室温下电导率为97.4％IAC。考虑到纳米曲线的高密度，解释了拉伸性能和导电性的增强机制。

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