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Characterization of Laser-Welded Ti Alloy and Stainless Steel Joint Using Cu Interlayer

机译:Cu中间层的激光焊接Ti合金和不锈钢接头的表征

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摘要

In this study, Cu was used as an interlayer to restrain the formation of brittle Ti-Fe intermetallics when joining Ti alloy to SS. Microstructures of the joint were analyzed using optical microscopy, scanning electron microscopy and x-ray diffraction. Besides, the tensile strength of the joint was also measured. The melting amount of base materials was controlled by changing thickness of Cu interlayer to control the melting proportion in weld. The melting amount of base materials in weld decreased with the thickness of Cu interlayer. The content of Cu solid solution in weld increased with the thickness of Cu interlayer. Ti-Cu compound layer was formed on the Ti alloy side. The width of the Ti-Cu compound layer increased with the increase in heat input. The tensile strength of joint was largely impacted by Ti-Cu compound layer. The tensile strength of joint first increased and then decreased with the increase in width of the Ti-Cu compound layer.
机译:在该研究中,Cu被用作中间层,以限制在将Ti合金连接到SS时抑制脆性Ti-Fe金属间质的形成。 使用光学显微镜,扫描电子显微镜和X射线衍射分析接头的微观结构。 此外,还测量了接头的拉伸强度。 通过改变Cu中间层的厚度来控制基础材料的熔化量以控制焊缝中的熔化比例。 焊缝中基材的熔融量随着Cu中间层的厚度降低。 焊缝中Cu固溶溶液的含量随Cu中间层的厚度而增加。 在Ti合金侧形成Ti-Cu复合层。 Ti-Cu复合层的宽度随着热输入的增加而增加。 关节的拉伸强度大部分受到Ti-Cu复合层的影响。 关节的拉伸强度首先增加,然后随着Ti-Cu复合层的宽度的增加而降低。

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