Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers

Sónia Sim?es; Filomena Viana; A. Sofia Ramos; M. Teresa Vieira; Manuel F. Vieira

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Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers

机译：使用纳米组的TiAl到Ti6Al4V的扩散键合

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Microstructural characterization of TiAl to Ti6Al4V dissimilar diffusion bonds assisted by reactive Ni/Al nanolayers was performed in this study. The nanolayers (alternated Al and Ni) were deposited onto the base material surfaces. Diffusion bonding was performed at 700 and 800?°C under pressures from 5 to 40?MPa and dwell times between 60 and 180?min. Microstructural characterization was performed using high-resolution transmission and scanning electron microscopies. The observations revealed that dissimilar TiAl to Ti6Al4V joints assisted by Ni/Al reactive nanolayers can be obtained successfully at 800?°C during 60?min using a pressure of 20?MPa. The bond interface is thin (less than 10?μm) and is mainly composed of NiAl grains. Thin layers of Al-Ni-Ti intermetallic compounds were formed adjacent to the base materials.

机译：本研究进行了反应性Ni / Al纳米组辅助辅助Ti6Al4V异种扩散键的微观结构表征。纳米组（交替的Al和Ni）沉积在基材表面上。在5至40℃的压力下在700和800℃下进行扩散键合，在60至180℃之间的压力和停留时间。使用高分辨率传输和扫描电子显微镜进行微观结构表征。观察结果表明，使用Ni / Al反应性纳米组辅助的Ti6Al4V接头可以在60℃下在60℃下使用20≤MPa的压力成功地在800Ω℃下成功获得。粘合界面薄（小于10？μm），主要由Nial谷物组成。薄层Al-Ni-Ti金属间化合物与基材相邻形成。

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来源
《Journal of Materials Engineering and Performance》 |2018年第10期|共5页
作者
Sónia Sim?es; Filomena Viana; A. Sofia Ramos; M. Teresa Vieira; Manuel F. Vieira;
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作者单位

CEMMPRE Department of Metallurgical and Materials Engineering University of Porto;

CEMMPRE Department of Metallurgical and Materials Engineering University of Porto;

CEMMPRE Department of Mechanical Engineering University of Coimbra;

CEMMPRE Department of Mechanical Engineering University of Coimbra;

CEMMPRE Department of Metallurgical and Materials Engineering University of Porto;

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正文语种 eng
中图分类金属学与金属工艺;工程材料学;
关键词
electron?microscopy; intermetallic; joining; nanomaterials; titanium;

机译：电子？显微镜;金属间化合物;加入;纳米材料;钛;

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1. Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers [J] . Sónia Sim?es, Filomena Viana, A. Sofia Ramos, Journal of Materials Engineering and Performance . 2018,第10期

机译：使用纳米组的TiAl到Ti6Al4V的扩散键合
2. TEM and HRTEM Characterization of TiAl Diffusion Bonds Using Ni/Al Nanolayers [J] . Simoes Sonia, Viana Filomena, Ramos Ana S., Microscopy and microanalysis: The official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada . 2015,第1期

机译：Ni / Al纳米层对TiAl扩散键的TEM和HRTEM表征
3. Diffusion bonding of gamma-TiAl using modified Ti/Al nanolayers [J] . L.I. Duarte, F. Viana, A.S. Ramos Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2012,第Suppla1期

机译：使用改性的Ti / Al纳米层扩散γ-TiAl的扩散键
4. Effects of hydrogen on diffusion bonding of TiAl-based intermetallics with hydrogenated Ti6Al4V alloy interlayer containing 0.5 wt hydrogen [C] . Lei Jia, Long Fan International Conference on Advanced Engineering Materials and Technology . 2013

机译：氢对含有0.5wt％氢的氢化Ti6Al4V合金中间层对基础金属间隔物的扩散键合的影响
5. Solid-Liquid Interdiffusion Bonding of Silicon Carbide to Steel for High Temperature MEMS Sensor Packaging and Bonding. [D] . Chan, Matthew Wei-Jen. 2013

机译：碳化硅与钢的固液互扩散键合，用于高温MEMS传感器的包装和键合。
6. Spark Plasma Diffusion Bonding of TiAl/Ti2AlNb with Ti as Interlayer [O] . Boxian Zhang, Chunhuan Chen, Jianchao He, 2020

机译：Tial / Ti2AlnB与Ti作为中间层的火花血浆扩散键合
7. Characterization of nanolayers at TiAl diffusion bonds [O] . S. Simões, F. Viana, A. S. Ramos, 2015

机译：TiAl扩散键的纳米层的表征
8. Adhesive Bonding Experiments for Titanium 6 Aluminum 4 Vanadium (Ti6Al4V). Part I. Anodization Treatments [R] . Baun, W. L. 1979

机译：钛6铝4钒（Ti6al4V）的粘接剂实验。第一部分阳极氧化处理

Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers

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