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首页> 外文期刊>Journal of Micromechanics and Microengineering >Cutting properties of deposited amorphous silicon in ultra-precision machining
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Cutting properties of deposited amorphous silicon in ultra-precision machining

机译：超精密加工中沉积非晶硅的切割性能

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摘要

The widely used amorphous silicon material is often a deposited one. It is mainly applied in the electronic industry and shows to be a promising candidate for optical devices. The mechanical cutting of deposited amorphous silicon has not been reported so far, while ultra-precision machining of such material for optical devices can be superior to a lithographic approach. In this article, for the first time, cutting properties of deposited amorphous silicon are compared with those of single crystal silicon and polycrystalline silicon, using plunge cut experiment. It is found that the critical depth of cut (CDC) and cutting forces for the amorphous silicon are close to those of single crystalline silicon in the easy-to-cut orientation. In comparison to the polycrystalline silicon, amorphous silicon has higher CDC and lower cutting force. This may allow machining of amorphous optical devices on different semiconductors and/or moulds on various materials with enhanced and isotropic CDC, reduced tool wear and simplified cutting control.
机译：广泛使用的非晶硅材料通常是沉积的。它主要应用于电子行业，并显示出光学设备的有希望的候选者。尚未报道沉积的非晶硅的机械切割尚未报道，而这种用于光学装置的材料的超精密加工可以优于光刻方法。在本文中，首次使用暴力切割实验将沉积的非晶硅和多晶硅的切割性能与单晶硅和多晶硅的切割性能进行比较。结果发现，无定形硅的切割（CDC）和切割力的临界深度与易切割的取向中的单晶硅的临界深度接近。与多晶硅相比，非晶硅具有更高的CDC和较低的切割力。这可以允许在具有增强和各向同性CDC的各种材料上加工不同半导体和/或模具的非晶光学器件，减少工具磨损和简化的切割控制。

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