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首页> 外文期刊>CERAMICS INTERNATIONAL >Surface characterization and diffusion model of pack bonded TB2 titanium alloy
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Surface characterization and diffusion model of pack bonded TB2 titanium alloy

机译：包装粘结Tb2钛合金包装的表面特征及扩散模型

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摘要

In this work, TB2 alloy was successfully bonded by pack bonding at the temperature range of 950-1100 degrees C for 5, 10, 20 and 30 h. The characteristics of boride layers were examined by X-ray diffraction, scanning electron microscopy, wavelength dispersive spectrometer, microhardness tester and micro vibration friction and wear tester. Based on the diffusion models of d(2) = Dt and d = kt(0.5), growth kinetics of the boride layers on TB2 alloy were investigated via the thickness of boride layers. There are dual boride layers on the surface of bonded TB2 alloy, i.e. the outer TiB2 layer and the inner TiB layer. The microhardness and coefficients of friction (CoF) of bonded TB2 alloy at 1100 degrees C for 30 h can reaches similar to 27.5 GPa and similar to 0.35, respectively. The diffusion model of d = kt(0.5) is found to predict the thickness of boride layer more accurately. Therefore, the boron activation energies in TiB layer and TiB2 layer are 96.220 and 158.056 kJ mol(-1), respectively. Finally, a comparison between the present boron activation energies and the reported available data was also made.
机译：在这项工作中，TB2合金通过在950-1100℃的温度范围内成功键合5,10,20和30小时。通过X射线衍射，扫描电子显微镜，波长色散光谱仪，微硬度测试仪和微振动摩擦和磨损测试仪检查硼化物层的特性。基于D（2）= DT和D = Kt（0.5）的扩散模型，通过硼化物层的厚度研究了TB2合金上的硼化物层的生长动力学。在粘结的Tb2合金表面上有双硼层面，即外部TiB2层和内部Tib层。在1100℃下键合Tb2合金30小时的键合Tb2合金的微硬度和系数可以达到类似于27.5GPa并且类似于0.35。发现D = Kt（0.5）的扩散模型更准确地预测硼化物层的厚度。因此，TIB层和TIB2层中的硼活化能量分别为96.220和158.056 kJ摩尔（-1）。最后，还制造了本硼激活能量和报告的可用数据之间的比较。

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