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首页> 外文期刊>Crystal growth & design >Atomic Layer Deposition of SnTe Thin Film Using Sn(N(CH3)(2))(4) and Te(Si(CH3)(3))(2) with Ammonia Coinjection
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Atomic Layer Deposition of SnTe Thin Film Using Sn(N(CH3)(2))(4) and Te(Si(CH3)(3))(2) with Ammonia Coinjection

机译:使用Sn(N(CH3)(2))(4)和TE(Si(CH 3)(3))(2)与氨注入的原子层沉积

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摘要

This study introduces the synthesis of conformal crystalline SnTe films through atomic layer deposition (ALD) using the sequential injection of Sn(N(CH3)(2))(4) and Te(Si(CH3)(3))(2) with NH3 coinjection. The one to one stoichiometry of the deposited SnTe films indicates the conversion of Sn(IV) to Sn(II) and the removal of Te(0) during the deposition process as a result of the redox reaction between Sn(IV) and Te2-. NH3 coinjection with Te(Si(CH3)(3))(2) facilitated the uniform growth of SnTe films even at high temperatures (>130 degrees C), where the growth was severely retarded in the absence of NH3 due to the desorption of the precursors from the substrates. The self-limiting growth rates of 93 and 150 ng.cm(-2).cycle(-1) (1.5 and 2.4 A.cycle(-1)) were obtained at 90 and 130 degrees C, respectively. The process produced high-purity, crystalline-as-deposited SnTe films with a face-centered cubic structure.
机译:本研究通过使用顺序注射Sn(N(CH 3)(2))(4)和TE(Si(CH3)(3))(2),介绍了通过原子层沉积(ALD)的共形晶体SNTE膜的合成 NH3投注。 沉积的SNET膜的一对一化学计量表明,在SN(IV)和TE2-之间的氧化还原反应的结果,Sn(IV)至Sn(II)的转化为Sn(IV)至Sn(II)和除去Te(0)的除去(IV)和TE2- 。 NH3与TE(Si(CH3)(3))(3))(2)促进SNET膜的均匀生长,即使在高温(> 130℃),在没有NH3的情况下由于解吸而严重延迟了生长 来自基材的前体。 在90和130℃下,93和150 ng.cm(-2)的自限流率为93和150 ng.cm(-2)。 该方法产生高纯度,结晶的晶体状的SNTE薄膜,具有面为中心的立方结构。

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