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机译:Sn-3.0AG-0.5Cu(SAC305)无铅焊料的微观结构和润湿行为研究在铜基材上添加1.0wt%SiC
Univ Miskolc Inst Phys Met Met Forming &
Nanotechnol Fac Mat Sci &
Engn H-3515 Miskolc Hungary;
Univ Miskolc Inst Phys Met Met Forming &
Nanotechnol Fac Mat Sci &
Engn H-3515 Miskolc Hungary;
Univ Miskolc Inst Phys Met Met Forming &
Nanotechnol Fac Mat Sci &
Engn H-3515 Miskolc Hungary;
Univ Miskolc Inst Phys Met Met Forming &
Nanotechnol Fac Mat Sci &
Engn H-3515 Miskolc Hungary;
Lead-free solder; RA (Rosin activated) flux; Silicon carbide; Spread factor; Spread ratio; Contact angle;
机译:ZnO纳米粒子的添加对Sn-5.0 wt%Sb-0.5 wt%Cu无铅焊料合金的热分析,组织演变和拉伸行为的影响
机译:掺杂Ni纳米粒子对Sn-3.0AG-0.5Cu(SAC305)/cu-2.0BE焊点的微观结构演化与剪切行为的影响
机译:掺杂纳米Ni对Sn-3.0Ag-0.5Cu(SAC305)/cu-2.0Be焊点在等温老化期间的微观结构演化和力学行为的影响
机译:SN-3.5AG-1.0CU-XZN无铅焊料和铜基材之间的润湿和金属间化学研究(x = 0,0.1,0.4,0.7)
机译:含金的银铜锡无铅焊料的冶金学研究。
机译:钛添加量对渗入Al-Si(10 wt。%)-xTi合金的SiC基复合材料的组织和力学性能的影响
机译:PCB基板表面光洁度和助焊剂对无铅SAC305合金可焊性的影响