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首页> 外文期刊>Journal of Materials Engineering and Performance >Failure of Printed Circuit Boards during Storage and Service: Leaked Capacitors and White Residue
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Failure of Printed Circuit Boards during Storage and Service: Leaked Capacitors and White Residue

机译：存储和服务期间印刷电路板的故障：泄漏电容器和白色残留物

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摘要

Failure of electronic components of printed circuit boards (PCBs) is a major concern, especially during storage. In the present study, we analyzed different modes of damages noticed on PCBs stored in coastal atmosphere such as leaking capacitors, white residues and attack around soldered joints. Fourier transform infrared spectroscopy, and pH measurements of the electrolyte from good and leaked capacitors indicated that the degraded electrolyte can cause capacitor leakage and subsequent failure. Scanning electron microscopy, energy dispersive x-ray analysis and x-ray photoelectron spectroscopy analysis of the white residue on PCB board showed the presence of phosphorus and oxygen as dendrites, formed due to the leaked electrolyte from capacitors on PCB. PCBs in continuous service with capacitor leak and white residue were also characterized. In this PCB, white residue was predominantly consisting of tin, oxygen and chlorine, which was formed due to corrosion of flux residue under high humid conditions. The damage around soldered joints of stored PCB board was found to be due to re-soldering, over heating which caused damage to the conformal coating and subsequent corrosion due to contaminants from flux residues. Based on the analysis of results, the probable mechanisms for the failure of PCBs are evolved, and the consequences for PCBs on prolonged storage and subsequent operation are also discussed.
机译：印刷电路板（PCB）的电子元件故障是一个主要问题，尤其是在存储期间。在本研究中，我们分析了储存在沿海大气中的多氯联苯的不同损坏模式，如电容器泄漏、白色残留物和焊接接头周围的腐蚀。傅立叶变换红外光谱和对完好和泄漏电容器电解液的pH测量表明，劣化的电解液会导致电容器泄漏和随后的故障。对PCB板上的白色残留物进行的扫描电子显微镜、能量色散x射线分析和x射线光电子能谱分析表明，磷和氧以树枝状存在，这是由于PCB上的电容器泄漏电解液而形成的。还对连续使用且电容器泄漏和白色残留物的PCB进行了表征。在该PCB中，白渣主要由锡、氧和氯组成，这是由于焊剂残留物在高湿度条件下的腐蚀而形成的。储存的PCB板焊接接头周围的损坏被发现是由于重新焊接、过热导致保形涂层损坏，以及随后由于焊剂残留物的污染物而导致的腐蚀。基于对结果的分析，总结了PCB失效的可能机制，并讨论了PCB对长期储存和后续操作的影响。

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