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首页> 外文期刊>Microwave and optical technology letters >Substrate integrated waveguide E-plane tapering in low-temperature co-fired ceramic
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Substrate integrated waveguide E-plane tapering in low-temperature co-fired ceramic

机译：基板集成波导E平面逐渐变细，低温共烧陶瓷

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摘要

This letter discusses the design, manufacture, and characterization of a substrate-integrated waveguide E-plane tapering. The tapering facilitates the integration of two waveguides with varying heights for, that is, conductor-backed coplanar waveguide to rectangular waveguide integration. A simultaneous top- and bottom-sided, lambda/4-based stepped tapering for the 71-86 GHz band is designed using low-temperature co-fired ceramic technology. The fabricated design is measured using two E-plane taperings in back-to-back configuration. The reflection coefficient better than -11.8 dB, and the transmission coefficient larger than -1.4 dB at the full 71-86-GHz range for a single tapering is extracted from the measurement using time-gating.
机译：这封信讨论了基片集成波导E面锥形的设计、制造和特性。锥形有助于两个不同高度的波导的集成，即导体支撑的共面波导到矩形波导的集成。采用低温共烧陶瓷技术，设计了一种适用于71-86 GHz频段的同时顶面和底面、基于lambda/4的阶梯式锥形。使用背靠背配置的两个E面锥形测量制造的设计。使用时间选通从测量中提取出在整个71-86-GHz范围内单锥度优于-11.8 dB的反射系数和大于-1.4 dB的透射系数。

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