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High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser

机译:高质量的高通量硅激光研磨,使用1 kW子皮秒激光

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摘要

We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 mu m to limit the peak fluence per pulse to approximately 0.7 J/cm(2), and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of S-a <= 0.6 mu m were achieved up to the investigated milling depth of 313 mu m while maintaining a high material removal rate of 230 mm(3)/min. (C) 2021 Optical Society of America
机译:我们报道了一种高质量、高通量的硅激光铣削技术,该技术使用亚ps激光器在工件上提供超过1kw的平均激光功率。为了避免热积累效应,高质量激光铣削的加工策略通过使用五个脉冲脉冲群、372μm的大光束直径将每个脉冲的峰值通量限制在约0.7 J/cm(2)和24 m/s的高进给速率来适应可用的平均功率。因此,Sa<0.6μm的低粗糙度光滑表面达到了313μm的铣削深度,同时保持了高材料去除率为230 mm(3)/min。(c)美国2021光学学会。

著录项

  • 来源
    《Optics Letters》 |2021年第2期|共4页
  • 作者单位

    Univ Stuttgart Inst Strahlwerkzeuge IFSW Pfaffenwaldring 43 D-70569 Stuttgart Germany;

    Univ Stuttgart Inst Strahlwerkzeuge IFSW Pfaffenwaldring 43 D-70569 Stuttgart Germany;

    Univ Stuttgart Inst Strahlwerkzeuge IFSW Pfaffenwaldring 43 D-70569 Stuttgart Germany;

    Robert Bosch GmbH Robert Bosch Campus 1 D-71272 Renningen Germany;

    Lasea Rue Chasseurs Ardennais 10 B-4031 Angleur Belgium;

    Amplitude Syst 11 Ave Canteranne F-33600 Pessac France;

    Univ Stuttgart Inst Strahlwerkzeuge IFSW Pfaffenwaldring 43 D-70569 Stuttgart Germany;

    Univ Stuttgart Inst Strahlwerkzeuge IFSW Pfaffenwaldring 43 D-70569 Stuttgart Germany;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 计量学;光学;
  • 关键词

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