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首页> 外文期刊>Applied optics >DESIGN CONSIDERATIONS AND ALGORITHMS FOR PARTITIONING OPTOELECTRONIC MULTICHIP MODULES
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DESIGN CONSIDERATIONS AND ALGORITHMS FOR PARTITIONING OPTOELECTRONIC MULTICHIP MODULES

机译：划分光电多芯片模块的设计注意事项和算法

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摘要

There is considerable interest in the development of optical interconnects for multichip modules (MCM's) to improve their performance. For effective utilization of the optical and electronic technologies, a methodology for partitioning the system is required. The key question to be answered is which technology should be used for each interconnect in a given netlist: optical or electronic. We introduce the computer-aided design approach for partitioning optoelectronic systems into optoelectronic MCM's. We first discuss the design trade-off issues in an optoelectronic system design, including speed, power dissipation, area, and diffraction limits for free-space optics. We then define a formulation for optoelectronic MCM partitioning and describe new algorithms for optimizing this partitioning based on the minimization of the power dissipation. The models for the algorithms are discussed in detail, and an example of a multistage interconnect network is given. Different results, with the number and size of chips being variable, are presented in which improvement for the system packaging has been observed when the partitioning algorithms are applied. [References: 17]
机译：为了改善其性能，对用于多芯片模块（MCM）的光学互连的开发引起了极大的兴趣。为了有效地利用光学和电子技术，需要一种用于划分系统的方法。要回答的关键问题是，给定网表中的每个互连都应使用哪种技术：光学或电子。我们介绍了用于将光电系统划分为光电MCM的计算机辅助设计方法。我们首先讨论光电系统设计中的设计权衡问题，包括速度，功耗，面积和自由空间光学器件的衍射极限。然后，我们定义了用于光电MCM分区的公式，并描述了基于功耗最小化来优化此分区的新算法。详细讨论了算法模型，并给出了一个多级互连网络的示例。提出了不同的结果，其中芯片的数量和大小是可变的，其中当应用分区算法时，已经观察到系统封装的改进。 [参考：17]

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