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首页> 外文期刊>Applied optics >Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits
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Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits

机译：通过使用与光电电路对接的成像光纤束演示多通道光学互连

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Through five experiments, we demonstrate and characterize the basic functionality of imaging fiber bundles for optoelectronic chip-level interconnections. We demonstrate the transmission of spot arrays with spot sizes and a spot pitch roughly equal to 2 and 4 times the core pitch, respectively. We show that optoelectronic integrated circuits, including sources and detectors, can be butt coupled directly to fiber bundles without any additional optical elements. We demonstrate a 16-channel interconnect with -23 dB of cross talk, and we characterize the most significant optical loss mechanism. Finally, we show how imaging fiber bundles can be used to implement more complex interconnection structures by an example of a hybrid-bonded structure that implements a low-cost, high-connectivity solution for more advanced system architectures.
机译：通过五个实验，我们演示并表征了用于光电芯片级互连的成像光纤束的基本功能。我们演示了光斑阵列的传输，光斑尺寸和光斑间距分别大约等于磁芯间距的2倍和4倍。我们表明，包括源和检测器在内的光电集成电路可以直接对接耦合到光纤束，而无需任何其他光学元件。我们演示了具有-23 dB的串扰的16通道互连，并描述了最重要的光损耗机制。最后，我们以混合粘结结构为例，说明如何将成像光纤束用于实现更复杂的互连结构，该结构为更高级的系统架构实现了低成本，高连接性的解决方案。

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