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Dispensing dots: assemblers have many options for dispensing surface-mount adhesive

机译:点胶:装配工可以选择许多点胶方式来粘贴表面贴装胶

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摘要

In the universe of automatic dispensing applications, the process of applying adhesives for attaching surface-mount components to circuit boards is a radically different animal. Production speeds are faster, accuracy requirements are stricter, and the quantities dispensed are significantly smaller. The size of a typical adhesive dot ranges from 0.7 to 1.5 millimeters in diameter. A dot for a very small component, such as an 0402, might be only 0.3 millimeter in diameter. Most components require only one dot, but a large part, such as an S016, might require two or three. "The big challenge today is to make smaller dots," says Gary Helmers, vice president of Creative Automation Co. (Sun Valley, CA). "The problem is, a lot of materials, especially silver-filled epoxies used in photonics applications, are extremely compressible. If you compress more material than you want to dispense, you have to find a way to relieve that pressure."
机译:在自动分配应用领域中,将粘合剂用于将表面贴装元件附着到电路板上的过程是完全不同的。生产速度更快,对精度的要求更高,所分配的数量也大大减少。典型的粘合点的大小范围为直径0.7到1.5毫米。一个非常小的组件(例如0402)的点的直径可能只有0.3毫米。大多数组件仅需要一个点,但是很大一部分(例如S016)可能需要两个或三个。 Creative Automation Co.(加利福尼亚州Sun Valley)副总裁Gary Helmers说:“当今最大的挑战是制造更小的点。 “问题在于,许多材料,特别是光子学应用中使用的银填充环氧树脂,都具有极高的可压缩性。如果压缩的材料多于想要分配的材料,则必须找到一种减轻压力的方法。”

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