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首页> 外文期刊>International Journal of Adhesion & Adhesives >Investigations on performance and failure mechanisms of high temperature thermoplastic polymers as adhesives
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Investigations on performance and failure mechanisms of high temperature thermoplastic polymers as adhesives

机译：高温热塑性聚合物胶粘剂的性能与失效机理研究

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摘要

Ability of high temperature thermoplastic polymers (TPs) to create strong bonds with metals provides an attractive solution to develop adhesives for harsh operating conditions. However, exploration of such TP based adhesives needs evaluation in desired operating temperature conditions along with understanding of failure mechanism which will serve as a platform for developing successive batches of composite adhesives or blends. In this work poly (ether sulphone) (PES), poly (ether ketone) PEK and poly (ether ether ketone) PEEK were explored as adhesives for joining cold rolled steel lap joints. The lap joints were evaluated for bond performance at various temperatures. The adhesive-bond performance order differed at different temperatures. At ambient temperature (AT) it was as; PES > PEK > PEEK, while at higher temperatures PEK proved the best followed by PEEK. Micro-Raman spectroscopy (MRS) analysis of failed films was carried out to understand the failure mechanism as a function of thermal and mechanical stresses. Differential scanning calorimetry and scanning electron microscopy (SEM) of fractured films was carried out to understand the changes in crystallinity, thermal characteristics and failure mechanisms. (C) 2016 Elsevier Ltd. All rights reserved.
机译：高温热塑性聚合物（TPs）与金属形成牢固键合的能力提供了一种有吸引力的解决方案，可以开发用于苛刻操作条件的粘合剂。然而，对这种基于TP的粘合剂的探索需要在期望的操作温度条件下进行评估，以及对破坏机理的理解，所述破坏机理将用作开发连续批次的复合粘合剂或共混物的平台。在这项工作中，研究了聚（醚砜）（PES），聚（醚酮）PEK和聚（醚醚酮）PEEK作为连接冷轧钢搭接接头的粘合剂。评价搭接接头在不同温度下的粘结性能。粘合性能的顺序在不同温度下有所不同。在环境温度（AT）下为： PES> PEK> PEEK，而在较高温度下，PEK表现最佳，其次是PEEK。进行了故障薄膜的微拉曼光谱分析（MRS），以了解故障机理与热应力和机械应力的关系。用差示扫描量热法和扫描电子显微镜（SEM）对断裂膜进行了研究，以了解其结晶度，热特性和破坏机理的变化。 （C）2016 Elsevier Ltd.保留所有权利。

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