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首页> 外文期刊>International Journal of Biomedical and Clinical Engineering. >Proposed Solution to the Problem of Thermal Stress Induced Failures in Medical Electronic Systems
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Proposed Solution to the Problem of Thermal Stress Induced Failures in Medical Electronic Systems

机译:医疗电子系统中由热应力引起的故障问题的建议解决方案

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摘要

The concept of miniaturization has propagated to all types of electronic applications. The complexity ofelectronic systems has been increasing due to increase in the number of functions and features offered to theusers. At the same time the number of devices workingper unitvolume of the system has increased enormously,due to which the power density per unit volume has increased. Dissipating high power in small volumes hasincreased the thermal problems in all types of electronic systems, including medical gadgets: Thermal stresshas been identified to be the major cause of failure of electronic devices in electronic systems, based on theanalysis of failures, based on research work. The causative mechanism of failure of semiconductor devicepackage due to thermal overstress in medical electronic systems is the differential expansion between plasticand metal parts of the device which causes a differential strain and package failure. Selection of materialswith similar coefficient of thermal expansion is important to prevent thermal overstress caused failures. Inthis paper, we discuss a technique which uses mathematical analysis to provide a solution to this problem ofselecting the suitable material to prevent differential thermal stress failures in medical electronics systems.
机译:小型化的概念已经传播到所有类型的电子应用中。由于提供给用户的功能和特征的数量增加,电子系统的复杂性一直在增加。同时,系统每单位体积工作的设备数量大大增加,因此单位体积的功率密度也随之增加。少量散发高功率已增加了所有类型的电子系统(包括医疗设备)的热问题:根据对故障的分析和研究工作,热应力已被确定为电子系统中电子设备故障的主要原因。由于医疗电子系统中的热过应力而导致半导体器件封装失效的原因是器件的塑料和金属部件之间的差异膨胀,从而导致差异应变和封装失效。选择具有相似热膨胀系数的材料对于防止热应力过大引起的故障很重要。在本文中,我们讨论一种使用数学分析的技术,以解决选择合适的材料以防止医疗电子系统中的不同热应力故障的问题。

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