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首页> 外文期刊>International journal of nanoscience >Thermal stability study of tantalum nitride thin films by spectroscopic ellipsometry
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Thermal stability study of tantalum nitride thin films by spectroscopic ellipsometry

机译：椭圆偏振光谱法研究氮化钽薄膜的热稳定性

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摘要

Spectroscopic ellipsometry was successfully applied in the evaluation of the thermal stability of thin films in air by detecting the changes in film optical properties and thickness. Tantalum nitride (Ta{sub}xN{sub}y) films with a nominal thickness of 30 nm were deposited on silicon wafer and annealed at different temperatures from 200℃ to 700℃. Annealing-induced changes in thickness and optical properties of Ta{sub}xN{sub}y were detected and determined by spectroscopic ellipsometry. Different approaches were adopted in the modeling and analysis of spectroscopic ellipsometric data. The results are consistent with the findings from Fourier Transform Infrared Spectroscopy (FTER).
机译：通过检测薄膜光学性质和厚度的变化，光谱椭圆偏振法已成功地用于评估薄膜在空气中的热稳定性。将标称厚度为30 nm的氮化钽（Ta {sub} xN {sub} y）薄膜沉积在硅片上，并在200℃至700℃的不同温度下进行退火。通过光谱椭圆偏振法检测并确定了退火引起的Ta {sub} xN {sub} y厚度和光学性能的变化。在光谱椭偏数据的建模和分析中采用了不同的方法。结果与傅立叶变换红外光谱（FTER）的结果一致。

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