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首页> 外文期刊>British Journal of Management >Measuring Dynamic Capabilities: Practices and Performance in Semiconductor Manufacturing
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Measuring Dynamic Capabilities: Practices and Performance in Semiconductor Manufacturing

机译:测量动态能力:半导体制造中的实践和性能

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Research on dynamic capabilities emphasizes the importance and role of organizational routines in explaining interfirm differences in performance. While performance differences are well documented, few empirical analyses explore the processes inside organizations that lead to dynamic capabilities or attempt to define and measure their performance effects. This paper examines one type of dynamic capability - the development and introduction of new process technologies in semiconductor manufacturing. This dynamic capability is an important source of competitiveness in the semiconductor industry, given the short product lifecycles, rapid price declines, and rapid technological advances that define the industry. Because much of the knowledge that underpins semiconductor manufacturing is idiosyncratic, firm-level R&D organization and information technology practices that facilitate problem solving and learning-based improvement provide important and enduring advantages. We derive models of the rate of improvement in manufacturing yield (i.e. the quality of production) and cycle time (i.e. the speed of production) following the development and introduction of new process technologies in manufacturing facilities, and test the empirical specifications of these models. The ways in which semiconductor manufacturers accumulate experience and articulate and codify knowledge within the manufacturing environment build new process development and introduction dynamic capabilities that improve performance.
机译:对动态能力的研究强调了组织惯例在解释企业间绩效差异中的重要性和作用。尽管有充分的绩效差异记录,但很少有实证分析探索组织内部导致动态功能或试图定义和衡量其绩效影响的过程。本文研究了一种动态能力-半导体制造中新工艺技术的开发和引进。鉴于产品生命周期短,价格快速下跌以及行业快速发展的技术条件,这种动态能力是半导体行业竞争的重要来源。因为支持半导体制造的许多知识是特质的,所以有助于解决问题和基于学习的改进的公司级研发组织和信息技术实践提供了重要而持久的优势。我们在制造设施中开发和引入新的工艺技术后,得出了制造成品率(即生产质量)和周期时间(即生产速度)的改善率模型,并测试了这些模型的经验指标。半导体制造商在制造环境中积累经验,表达和整理知识的方式可建立新的工艺开发并引入可提高性能的动态功能。

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