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首页> 外文期刊>International Journal of Solids and Structures >Analysis of a mode-I crack perpendicular to an imperfect interface
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Analysis of a mode-I crack perpendicular to an imperfect interface

机译：垂直于不完美界面的I型裂纹的分析

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摘要

The elastostatic problem of a mode-I crack embedded in a bimaterial with an imperfect interface is inves_tigated. The crack is in proximity to and perpendicular to the imperfect interface, which is governed by linear spring-like relations. The Fourier transform is applied to reduce the associated mixed-boundary value problem to a singular integral equation with Cauchy kernel. By numerically solving the resulting equation, stress intensity factors near both crack tips are evaluated. Obtained results reveal that the stress intensity factors in the presence of the imperfect interface vary between that with a perfect inter_face and that with a completely debonding interface. Moreover, an increase in the interface parameters decreases the stress intensity factors. In particular, when crack approaches to the weakened interface clo_ser, the stress intensity factors become larger for a sliding interface, and become larger or smaller for a Winkler interface, depending on the crack lying in a stiffer or softer material. The influences of the imperfection of the interface on the stress intensity factors for a bimaterial composed of aluminum and steel are presented graphically.
机译：研究了界面不完美的双材料中嵌入的I型裂纹的弹力问题。裂纹接近并垂直于不完美的界面，该界面由线性弹簧状关系控制。应用傅里叶变换将相关的混合边界值问题简化为具有柯西核的奇异积分方程。通过数值求解所得方程，可以评估两个裂纹尖端附近的应力强度因子。所得结果表明，存在不完善界面的应力强度因子在具有完美界面的界面和具有完全脱胶界面的界面之间变化。此外，界面参数的增加会降低应力强度因子。特别地，当裂纹接近弱化的界面闭合剂时，应力强度因子对于滑动界面变得更大，而对于Winkler界面变得更大或更小，这取决于位于更硬或较软材料中的裂纹。用图形表示了界面缺陷对铝和钢双材料应力强度因子的影响。

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