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Rigid square inclusion embedded within an epoxy disk: asymptotic stress analysis

机译:嵌入环氧树脂盘中的刚性正方形夹杂物:渐进应力分析

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The asymptotically singular stress state found at the tip of a rigid, square inclusion embedded within a thin, linear elastic disk has been determined for both uniform cooling and an externally applied pressure. Since these loadings are symmetric, the singular stress held is characterized by a single stress intensity factor K-a, and the applicable K-a calibration relationship has been determined for both a fully bonded inclusion and an unbonded inclusion with frictionless sliding. A lack of interfacial bonding has a profound effect on inclusion-tip stress fields. When the inclusion is fully bonded, radial compression dominates in the region directly in front of the inclusion tip and there is negligible tensile hoop stress. When the inclusion is unbonded the radial stress at the inclusion tip is again compressive, but now the hoop tensile stress is of equal magnitude. Consequently, an epoxy disk containing an unbonded inclusion appears to be more likely to crack when cooled than a disk containing a fully bonded inclusion. Plastic-plastic calculations show that when the inclusion is unbonded, encapsulant yielding has a significant effect on the inclusion-tip stress state. Yielding relieves stress parallel to the interface and greatly reduces the radial compressive stress in front of the inclusion. As a result, the encapsulant is subjected to a nearly uniaxial tensile stress at the inclusion tip. For a typical high-strength epoxy, the calculated yield zone is embedded within the region dominated by the elastic hoop stress singularity. A limited number of tests have been carried out to determine if encapsulant cracking can be induced by cooling a specimen fabricated by molding a square, steel insert within a thin epoxy disk. Test results are in qualitative agreement with analysis. Cracks developed only in disks with mold-released inserts, and the tendency for cracking increased with inclusion size. (C) 2001 Published by Elsevier Science Ltd. [References: 17]
机译:对于均匀冷却和外部施加的压力,已经确定了嵌入在薄的线性弹性盘中的刚性方形夹杂物尖端处的渐近奇异应力状态。由于这些载荷是对称的,因此所保持的奇异应力的特征在于单个应力强度因子K-a,并且针对完全结合的夹杂物和无摩擦滑动的未结合的夹杂物都确定了适用的K-a校准关系。缺乏界面结合对夹杂物尖端应力场具有深远的影响。当夹杂物完全结合后,径向压缩在夹杂物尖端正前方的区域占主导地位,并且拉伸环向应力可忽略不计。当夹杂物未粘结时,夹杂物尖端的径向应力再次处于压缩状态,但现在环向拉应力的大小相等。因此,含有未结合的夹杂物的环氧树脂盘在冷却时比含有完全结合的夹杂物的盘看起来更容易破裂。弹塑性计算表明,当夹杂物未粘结时,密封剂的屈服对夹杂物尖端的应力状态有显着影响。屈服可减轻平行于界面的应力,并大大降低夹杂物前面的径向压应力。结果,密封剂在夹杂物尖端处承受几乎单轴的拉伸应力。对于典型的高强度环氧树脂,计算出的屈服区嵌入在弹性环向应力奇异性占主导的区域内。已经进行了有限数量的测试,以确定是否可以通过冷却通过在薄环氧树脂盘中模制方形钢插件而制成的样品进行冷却来引发密封剂开裂。测试结果与分析定性一致。裂纹仅在带有脱模刀片的盘中产生,并且裂纹的趋势随夹杂物尺寸的增加而增加。 (C)2001年由Elsevier Science Ltd.出版[参考文献:17]

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