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首页> 外文期刊>Electrical engineering in Japan >A Basic Study of Defect Inspection Methods for ASIC Manufacturing Line (Second Report: Inspection Parameter Dependence on Yield and Cleaning Cycle)
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A Basic Study of Defect Inspection Methods for ASIC Manufacturing Line (Second Report: Inspection Parameter Dependence on Yield and Cleaning Cycle)

机译:ASIC生产线缺陷检查方法的基础研究(第二份报告:检查参数取决于产量和清洗周期)

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摘要

The results of strict defect control include both the enhancement of manufacturing yield and increased delivery delay due to a drop in the machine operation rate. Therefore, defect inspection methods must be optimized for this trade-off, especially for ASIC manufacturing. In the first paper, we proposed a new manufacturing model which treats not only inspection and the yield model, but also the workflow model. In this paper, we formulate the inspection parameter dependence on the manufacturing yield and the machine cleaning cycle, which may affect delivery time. By using the resulting formulas, factory engineers can obtain practical information for inspection parameter optimization.
机译:严格缺陷控制的结果既包括提高生产良率,又由于降低机器运行速度而增加了交货延迟。因此,必须针对这种折衷优化缺陷检查方法,尤其是对于ASIC制造而言。在第一篇论文中,我们提出了一种新的制造模型,该模型不仅处理检验和成品率模型,而且还处理工作流模型。在本文中,我们根据生产良率和机器清洁周期来制定检查参数,这可能会影响交货时间。通过使用得出的公式,工厂工程师可以获取有关检验参数优化的实用信息。

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