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首页> 外文期刊>IEEE Transactions on Energy Conversion >Thermal Coupling Analysis in a Multichip Paralleled IGBT Module for a DFIG Wind Turbine Power Converter
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Thermal Coupling Analysis in a Multichip Paralleled IGBT Module for a DFIG Wind Turbine Power Converter

机译：DFIG风力涡轮机功率转换器的多芯片并联IGBT模块中的热耦合分析

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摘要

Thermal coupling between adjacent insulated gate bipolar transistor (IGBT) or diode chips is the result of nonuniform temperature distribution in a multichip IGBT module. This affects the junction temperatures and hence the total power loss predicted for the module. The study first investigates the impact of thermal coupling effect on the junction temperatures through a finite element method, and then develops a thermal coupling impedance model to represent such effects. The effect is shown to reduce with the distance exponentially. The model result agrees well with the test. The validated model is then used to predict the junction temperature swings during operational power cycling in a doubly fed induction generator wind turbine, showing the difference between the rotor and grid side converters. The model presented and the results obtained may be important for reliability evaluation and condition monitoring in the wind turbine power converters as well as in other multichip-paralleled power electronic systems.
机译：相邻绝缘栅双极晶体管 （IGBT） 或二极管芯片之间的热耦合是多芯片 IGBT 模块中温度分布不均匀的结果。这会影响结温，从而影响模块预测的总功率损耗。该研究首先通过有限元方法研究了热耦合效应对结温的影响，然后建立了热耦合阻抗模型来表示这种效应。该效应显示随着距离的增加呈指数级下降。模型结果与测试结果吻合良好。然后，验证后的模型用于预测双馈感应发电机风力涡轮机运行功率循环期间的结温波动，显示转子和电网侧转换器之间的差异。所提出的模型和获得的结果对于风力涡轮机功率转换器以及其他多芯片并联电力电子系统的可靠性评估和状态监测可能很重要。

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