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Photocatalytically initiated electroless deposition of macroporous metal films onto insulating substrates

机译:大孔金属膜的光催化引发化学沉积在绝缘基板上

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摘要

By using photocatalytically initiated electroless deposition (PIED) we have deposited macroporous metal films with highly ordered arrays of sub-μm (hemi)spherical pores directly onto the surface of insulating substrates for the first time. This has been achieved by sensitisation of the target substrate with a TiO _2 photocatalyst followed by PIED of the target metal into the interstitial spaces of a template composed of hexagonally close packed polystyrene microspheres.
机译:通过使用光催化引发的化学沉积(PIED),我们首次将具有亚微米(半)球形孔的高度有序阵列的大孔金属膜直接沉积在绝缘基板的表面上。这是通过用TiO _2光催化剂对目标基材进行敏化,然后将目标金属PIED注入由六方密堆积聚苯乙烯微球组成的模板的间隙中实现的。

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