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首页> 外文期刊>Electrochimica Acta >A novel polymeric leveller for the electrodeposition of copper from acidic sulphate bath: A spectroelectrochemical investigation
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A novel polymeric leveller for the electrodeposition of copper from acidic sulphate bath: A spectroelectrochemical investigation

机译：用于从酸性硫酸盐浴中电沉积铜的新型聚合物整平剂：光谱电化学研究

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摘要

The electrodeposition of copper has recently become a "hot topic" due to its extensive application to the fabrication of interconnects in the integrated circuits (IC) manufacturing process. However, the proper composition of the electrochemical deposition (ECD) bath, and in particular the selection of the levelling agent, represents one of the crucial factors for an effective transition of Cu ECD towards the most advanced technology nodes. In this paper we report on the electrodeposition of Cu from acidic sulphate baths containing a potential innovative polymeric leveller: a benzyl-phenyl modified polyethyleneimine (BPPEI). This investigation was carried out by: (i) cyclic voltammetry (CV) at a rotating-disk electrode, (ii) in situ surface-enhanced Raman spectroscopy (SERS) during electrodeposition and (iii) scanning electron microscopy (SEM). CV results show that BPPEI acts as an inhibitor of the electrodeposition process, since it reduces the exchange current density and increases the cathodic Tafel slope. Mass transport limitations to the Cu(II) reduction process are essentially unaffected by the presence of BPPEI. SERS spectra show that BPPEI is adsorbed at the growing Cu cathode at all potentials of interest for electroplating. SEM micrographs prove that BPPEI acts as an efficient grain-refiner and suppressor of unstable 3D growth. Cathodic reactivity of BPPEI was proved by the analysis of CV features and potential-dependent SERS spectral changes.
机译：铜的电沉积由于其广泛应用于集成电路（IC）制造工艺中互连的制造，最近已成为“热门话题”。但是，电化学沉积（ECD）槽的正确组成，特别是流平剂的选择，代表了Cu ECD向最先进技术节点有效过渡的关键因素之一。在本文中，我们报告了从酸性硫酸盐浴中电解铜的过程，该硫酸盐浴中含有潜在的创新型聚合物整平剂：苄基苯基改性的聚乙烯亚胺（BPPEI）。这项研究是通过以下方式进行的：（i）旋转圆盘电极的循环伏安法（CV），（ii）电沉积过程中的原位表面增强拉曼光谱（SERS）和（iii）扫描电子显微镜（SEM）。 CV结果表明BPPEI可以抑制电沉积过程，因为它降低了交换电流密度并增加了阴极Tafel斜率。 BPPEI的存在基本上不会影响Cu（II）还原过程的传质限制。 SERS光谱表明，BPPEI在所有感兴趣的电镀电位下都吸附在生长的Cu阴极上。 SEM显微照片证明BPPEI可以作为有效的晶粒细化剂和3D不稳定生长的抑制剂。 BPPEI的阴极反应性通过分析CV特征和电势相关的SERS光谱变化来证明。

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