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首页> 外文期刊>Electrochimica Acta >In situ electrochemical Scanning Kelvin Probe Blister-Test studies of the de-adhesion kinetics at polymer/zinc oxide/zinc interfaces
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In situ electrochemical Scanning Kelvin Probe Blister-Test studies of the de-adhesion kinetics at polymer/zinc oxide/zinc interfaces

机译：原位电化学扫描开尔文探针吸塑试验研究聚合物/氧化锌/锌界面上的脱粘动力学

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摘要

Fundamental investigations of the polymer/zinc oxide/zinc interface corrosion stability were performed in situ by means of the electrochemical Height Regulated Scanning Kelvin Probe Blister-Test (HR-SKP-BT) under controlled atmospheric conditions. A hole under an adhesive layer film served as electrolyte reservoir to initiate cathodic de-adhesion processes. Then a combinatorial approach was undertaken to simultaneously study the influence of electrolyte pressure at constant defect polarisation and of relative atmospheric humidity on the de-adhesion rate. The time resolved blister growth and the propagation of the three phase boundary polymer/oxide covered zinc/interfacial electrolyte layer could be detected. It could be proven that the oxygen reduction induced electrochemical damage of the interface precedes the subsequent mechanical de-adhesion process. By variation of the relative atmospheric humidity the water concentration within the bulk adhesive and its interphase adjacent to the metal substrate could be adjusted. These processes were further analysed by peel-tests and in situ Attenuated-Total-Reflection Infrared Spectroscopy (ATR-IR) studies of water diffusion. A decrease of the interphasial water concentration led to a deceleration of the de-adhesion kinetics for constant defect conditions and to smaller interfacial ion transport rates. This could be assigned to an inhibition of the electron transfer reactions at the front of de-adhesion and an increased adhesion force between polymer film and oxide covered metal preventing the formation of an extended interfacial electrolyte layer.
机译：聚合物/氧化锌/锌界面腐蚀稳定性的基础研究是通过在受控大气条件下通过电化学高度调节扫描开尔文探针泡罩试验（HR-SKP-BT）进行的。粘合剂层膜下面的孔用作电解质储存器，以启动阴极去粘过程。然后采用组合方法同时研究了在恒定缺陷极化和相对大气湿度下电解质压力对脱粘率的影响。可以检测到时间分辨的水疱生长和三相边界聚合物/氧化物覆盖的锌/界面电解质层的扩散。可以证明，氧还原引起的界面电化学损伤先于随后的机械脱粘过程。通过改变相对大气湿度，可以调节本体粘合剂及其与金属基材相邻的界面之间的水浓度。通过剥离测试和水扩散的原位衰减全反射红外光谱（ATR-IR）研究进一步分析了这些过程。相间水浓度的降低导致在恒定缺陷条件下脱粘动力学的降低以及界面离子传输速率的降低。这可以归因于在脱粘前抑制电子转移反应，以及在聚合物膜和氧化物覆盖的金属之间增加的粘着力，从而防止形成扩展的界面电解质层。

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