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Anodic bonding

机译：阳极键合

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Originally developed in the late 1960s, anodic bonding, also known as electrostatic bonding, field-assisted bonding or Mallory bonding, has become one of the most important silicon packaging techniques. Despite its industrial relevance the bonding mechanism is mainly only qualitatively understood and is almost solely applied to the bonding of silicon to Pyrex glass. The objective of the present paper is to review the current state of knowledge of the anodic bonding process. Possible material combinations and current scientific and industrial applications of this bonding technique are reviewed. The various aspects of the bonding process, such as the creation of intimate contact, the cation movement in the glass and the interfacial chemical reactions, are discussed in detail and related to the external current measured during bonding to describe the bonding process quantitatively. A better understanding of the process itself should help not only to improve the process control and the quality of devices, but also to broaden the application of this successful bonding technique to more challenging designs, to smaller device sizes and to systems other than silicon-Pyrex glass.
机译：阳极键合最初开发于1960年代后期，也称为静电键合，场辅助键合或马洛键合，已成为最重要的硅封装技术之一。尽管具有工业相关性，但键合机理主要还是从质上理解，并且几乎仅应用于将硅与派热克斯玻璃粘合。本文的目的是回顾阳极键合工艺的当前知识状态。审查了可能的材料组合以及该粘合技术的当前科学和工业应用。详细讨论了键合过程的各个方面，例如紧密接触的产生，玻璃中的阳离子运动和界面化学反应，它们与键合过程中测得的外部电流有关，以定量描述键合过程。更好地了解过程本身不仅有助于改善过程控制和设备质量，而且还可以将这种成功的键合技术的应用范围扩展到更具挑战性的设计，更小的设备尺寸以及除硅派热克斯之外的其他系统玻璃。

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