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Structural and Electromechanical Behavior Evaluation of Polymer-Copper Nanocomposites

机译:聚合物铜纳米复合材料的结构和机电性能评估

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Copper nanoparticles were prepared by chemical reduction of copper nitrate by sodium borohydride as a reducing agent in de-ionized water/acetonitrile mixture. The prepared nanoparticles were incorporated in poly(vinyl alcohol) (PVA) by physical dispersion method to obtain PVA/copper nanocomposites. Various compositions of nanocomposites were obtained by changing the w/w ratio of nanoparticles with the polymeric material. The prepared nanocomposites cast into films of uniform thickness. The composite films were subjected to the electrical, mechanical and surface morphology characterization. AC Impedance was figured out by AC Impedance analyser. The results illustrated that copper nanoparticles impart electrical conductivity in poly(vinyl alcohol). Moreover, electrical conductivity of the composites exhibited an increase with an increase of w/w% of the copper nanoparticles in poly(vinyl alcohol). Tensile properties were studied in terms of tensile strength, elongation at break and Young's modulus. Elongation at break and Young's modulus values demonstrated an increase while tensile strength displayed a decrease at higher concentration of the copper nanoparticles in the composites. AFM results unfolded the surface morphology of the composites illustrating a smooth surface with evenly distributed copper nanoparticles in the polymer matrix. The dimensions of the uneven surface is attributed to the copper nanoparticles were estimated to be of a range less than 100 nm. The prepared nanocomposites are suggested as potential candidates in charge storing devices.
机译:通过在去离子水/乙腈混合物中用硼氢化钠作为还原剂化学还原硝酸铜来制备铜纳米颗粒。通过物理分散法将制备的纳米颗粒掺入聚乙烯醇(PVA)中以获得PVA /铜纳米复合材料。通过改变具有聚合物材料的纳米颗粒的w / w比,获得了纳米复合材料的各种组成。制备的纳米复合材料流延成均匀厚度的薄膜。对复合膜进行电,机械和表面形态表征。交流阻抗由交流阻抗分析仪确定。结果表明,铜纳米颗粒在聚乙烯醇中具有导电性。此外,随着聚乙烯醇中铜纳米颗粒的w / w%的增加,复合材料的电导率也随之增加。根据拉伸强度,断裂伸长率和杨氏模量研究了拉伸性能。断裂伸长率和杨氏模量值显示出增加,而抗拉强度显示出在复合物中铜纳米颗粒的较高浓度下降低。 AFM结果显示了复合材料的表面形态,显示了光滑的表面,铜纳米颗粒均匀分布在聚合物基质中。不平坦表面的尺寸归因于铜纳米颗粒,估计其范围小于100nm。建议将制备的纳米复合材料作为电荷存储装置中的潜在候选物。

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