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Editorial: Special Section on Micromanufacturing Processes and Applications

机译:社论:微制造过程和应用特别节

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摘要

The demand for mesoscale (500 mum-10mm) and microscale (0.1-500 mum) products with high aspect ratios and superior surfaces has been rapidly increasing in aerospace, automotive, defense, medical, optical, and microelectronics packaging industries. There is a growing need for fast, direct, and mass manufacturing of miniaturized functional products from metals, polymers, and ceramics. Unlike established technologies to produce semiconductor products (typical for the electronics industry), technologies for mass manufacturing of meso/microparts and components in metal alloys, polymers, and ceramics are still under development, and present a number of research issues and challenges. This special session invites contributions from academia and industry on recent advances and developments in micromanufacturing processes, materials for microfabrication, miniaturized machine tools, sensors, and instrumentation for metrology in order to provide an information exchange among researchers with different experiences.
机译:在航空航天,汽车,国防,医疗,光学和微电子包装行业,对具有高长宽比和优异表面的中型(500 mum-10mm)和微型(0.1-500 mum)产品的需求正在迅速增长。对由金属,聚合物和陶瓷制成的微型功能产品的快速,直接和大规模生产的需求不断增长。与用于生产半导体产品(通常用于电子行业)的成熟技术不同,用于金属合金,聚合物和陶瓷中的介观/微零件和组件的批量生产的技术仍在开发中,并且提出了许多研究问题和挑战。本届特别会议邀请学术界和工业界对微制造工艺,微制造材料,微型机床,传感器和计量仪器的最新进展和发展做出贡献,以便在具有不同经验的研究人员之间进行信息交流。

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