...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Materials transactions >Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
【24h】

Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

机译：用有限元分析预测无铅BGA焊点的热疲劳寿命

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This study was focused on the numerical prediction of the thermal fatigue life of a #mu#BGA (Micro Ball Grid Array) solder joint. Numerical method was performed to predict three-dimensional finite element analysis with various solder alloys such as Sn-37 mass percent Pb, Sn-3.5 mass percent Ag, Sn-3.5 mass percent Ag-0.7 mass percent Cu and Sn-3.5 mass percent Ag-3 mass percent In-0.5 mass percent Bi during a given thermal cycling. Strain values, which were obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5 mass percent Ag with the 50 degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable #gamma#.
机译：这项研究的重点是＃mu＃BGA（微型球栅阵列）焊点的热疲劳寿命的数值预测。使用数值方法来预测各种焊料合金的三维有限元分析，如Sn-37质量百分比的Pb，Sn-3.5质量百分比的Ag，Sn-3.5质量百分比的Ag-0.7质量百分比的Cu和Sn-3.5质量百分比的Ag在给定的热循环过程中，Bi含量为-3质量百分比，Bi含量为-0.5质量百分比。通过对焊料合金进行机械疲劳测试得到的应变值，可以使用Coffin-Manson方程来预测焊点疲劳寿命。数值结果表明，在低循环疲劳中，具有50度球形几何形状的Sn-3.5质量％Ag具有最长的热疲劳寿命。还通过使用无量纲变量＃gamma＃提出了用于预测热疲劳寿命的实用关联。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号