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首页> 外文期刊>Materials Characterization >Use of digital speckle pattern correlation for strain measurements in a CuAlBe shape memory alloy
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Use of digital speckle pattern correlation for strain measurements in a CuAlBe shape memory alloy

机译：使用数字散斑图相关性在CuAlBe形状记忆合金中进行应变测量

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摘要

A Cu-Al 11.2 wt. percent-Be 0.6 wt. percent shape memory alloy was subjected to a uniaxial tension test using an MTS load frame with an attached optical microscope. Digital images of the sample's surface were acquired using white light and He-Ne laser illumination. The obtained images were associated to the engineering stress-strain behavior, which was calculated from the measured displacement, strain and force. From the images, displacement vector fields were calculated for white light and laser illumination by digital image correlation (DIC) and digital speckle pattern correlation (DSPC) techniques respectively. Using white light it was possible to observe the grains and the martensitic phase transformation of the material more clearly than using DSPC; nevertheless, better quantitative results of displacement, in-plane strain and elastic moduli were obtained using DSPC than using DIC when they were compared to the reference values measured by electrical extensometry. Furthermore DIC and DSPC work as complementary techniques to determined the micro and macromechanical behavior of the CuAlBe shape memory alloy.
机译：Cu-Al 11.2 wt。百分比为0.6 wt。使用带有附接的光学显微镜的MTS负载框架，对50％的形状记忆合金进行单轴拉伸测试。使用白光和He-Ne激光照明获取样品表面的数字图像。所获得的图像与工程应力-应变行为有关，该行为是根据测得的位移，应变和力计算得出的。从图像中，分别通过数字图像相关（DIC）和数字散斑图案相关（DSPC）技术为白光和激光照明计算了位移矢量场。与使用DSPC相比，使用白光可以更清楚地观察到材料的晶粒和马氏体相变。但是，当与通过电引伸法测量的参考值进行比较时，与使用DIC相比，使用DSPC获得的位移，面内应变和弹性模量的定量结果更好。此外，DIC和DSPC作为补充技术来确定CuAlBe形状记忆合金的微观和宏观力学行为。

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