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首页> 外文期刊>Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science >Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders
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Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

机译：用于高可靠性，无铅焊料的Sn-Cu-Al合金的快速凝固：第一部分。快速凝固的焊料的微结构特征

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摘要

Particles of Cu (x) Al (y) in Sn-Cu-Al solders have previously been shown to nucleate the Cu6Sn5 phase during solidification. In this study, the number and size of Cu6Sn5 nucleation sites were controlled through the particle size refinement of Cu (x) Al (y) via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu (x) Al (y) and Cu6Sn5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu (x) Al (y) and Cu6Sn5 phases. Transitions in the Cu6Sn5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 10(3) to 10(4) A degrees C/s were found to be optimal for realizing particle size refinement and maintaining the Cu (x) Al (y) /Cu6Sn5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary-beta phase in the solidified alloys was noted. Solidification pathways omitting the formation of the ternary-beta phase agreed well with observed room temperature microstructures.
机译：先前已显示，Sn-Cu-Al焊料中的Cu（x）Al（y）颗粒在固化过程中使Cu6Sn5相成核。在这项研究中，Cu6Sn5成核位点的数量和大小是通过快速凝固工艺和差示扫描量热仪中的受控冷却，通过对Cu（x）Al（y）的粒度细化来控制的。跨越八个数量级的冷却速率用于将平均Cu（x）Al（y）和Cu6Sn5颗粒尺寸降低至亚微米范围。分析了显微组织中的平均粒径，粒径分布和形态，它们是合金成分和冷却速率的函数。样品的深蚀刻揭示了三维微观结构，并阐明了Cu（x）Al（y）和Cu6Sn5相之间的外延和形态关系。观察到Cu6Sn5颗粒形态从多面棒向无面等轴颗粒的转变是冷却速率和组成的函数。发现初始凝固冷却速率在10（3）到10（4）A / s的范围内是实现粒度细化和保持Cu（x）Al（y）/ Cu6Sn5 nucleant关系的最佳方法。另外，几乎没有证据表明在凝固合金中三元β相的形成或分解。省略三元-β相形成的固化途径与观察到的室温微观结构非常吻合。

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