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首页> 外文期刊>Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science >Thermal Contact Conductance Analysis of Nitride and Carbonitride Thin Film Coatings for Thermal Interface Material Application
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Thermal Contact Conductance Analysis of Nitride and Carbonitride Thin Film Coatings for Thermal Interface Material Application

机译：用于热界面材料的氮化物和碳氮化物薄膜涂层的热接触电导分析

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In order to reduce and maintain the bond line thickness between substrate and LED package, solid thin film with good thermal conductivity is suggested as thermal interface material and the proposed film thickness is about less than 1 mu. The surface parameter such as roughness and hardness is a key factor which alters the contact conductance between the two matt surfaces. Consequently, filtered vacuum cathodic arc deposited nitride thin films (CrN, TiN, AlTiN, and TiCN) on copper substrate were tested for thermal interface material applications in electronic packaging. The thermal contact conductance of the prepared thin films was evaluated using surface properties such as microhardness and surface roughness. The results were verified with the theoretical model. The measured microhardness and surface roughness of CrN thin film are 17 GPa (low) and 0.768 mu m (high), respectively. The measured thermal contact conductance of all thin films showed linear properties for applied pressure and very close to the values of theoretical model. High value in thermal contact conductance of about 256 W/m(2) K was noticed with CrN thin film at 1100 kPa. The percentage of deviation for our measured contact conductance value from the theoretical model value was decreasing for the increased contact pressure and observed low value (7 pct) for CrN thin film at 1100 kPa. The thermal conductivity of all thin films was also calculated from the conductance model and observed high value (19.34 W/mK) with CrN thin film. (C) The Minerals, Metals & Materials Society and ASM International 2015
机译：为了减小和保持基板与LED封装之间的键合线厚度，建议将具有良好导热性的固体薄膜用作热界面材料，并且所提出的膜厚度小于约1μ。诸如粗糙度和硬度之类的表面参数是改变两个无光泽表面之间的接触电导率的关键因素。因此，测试了在铜基板上过滤的真空阴极电弧沉积的氮化物薄膜（CrN，TiN，AlTiN和TiCN）的热界面材料在电子包装中的应用。使用诸如显微硬度和表面粗糙度之类的表面性质来评价所制备的薄膜的热接触电导率。理论模型验证了结果。测得的CrN薄膜的显微硬度和表面粗糙度分别为17 GPa（低）和0.768μm（高）。测量的所有薄膜的热接触电导率显示了施加压力的线性特性，非常接近理论模型的值。 CrN薄膜在1100 kPa时发现约256 W / m（2）K的高热接触电导值。随着接触压力的增加，我们测得的接触电导率值与理论模型值的偏差百分比正在减小，并且在1100 kPa下观察到的CrN薄膜的低值（7 pct）。还从电导模型计算了所有薄膜的热导率，并用CrN薄膜观察到了高值（19.34 W / mK）。 （C）矿物，金属和材料学会和ASM International 2015

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