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首页> 外文期刊>精密工学会誌 >ArF Excimer Laser Ablation of Quartz Crystal Wafer-A Possibility to Control Oscrillating Frequency
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ArF Excimer Laser Ablation of Quartz Crystal Wafer-A Possibility to Control Oscrillating Frequency

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Demand for the high frequency quartz oscillator is significantly increasing In order to generate 100 MHz band frequency directly, the thickness of quartz must be thinner than 17 #mu#m and the thickness accuracy must be smaller than nanometer. This paper deals with the chemical ablation of the quartz crystal wafer with an ATF excimer laser in CF_2Br_2 gas. Effects of the reactive gas pressure, beam energy fluence etc. on the surface features, roughness and removal rate were investigated experimentally. It was shown that oscillating frequency of the quartz wafer will be able to control by ArF laser chemical ablation.

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