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首页> 外文期刊>Microwave and optical technology letters >WIDEBAND PERFORMANCE OF 3 Db MICROSTRIP-SLOT COUPLER USING DIFFERENT SUBSTRATES
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WIDEBAND PERFORMANCE OF 3 Db MICROSTRIP-SLOT COUPLER USING DIFFERENT SUBSTRATES

机译：使用不同基带的3 Db微带隙耦合器的宽带性能

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摘要

This article presents the design of an elliptically shaped microstrip-slot coupler using different thickness and permittivity substrates that is aimed for operation in 3.0-11.0 GHz band. CST Microwave Studio simulator is applied to its design and performance assessment. Design with the best performance is fabricated to validate the investigation. It is shown that the wideband operation of this type of coupler is predominantly dependent on the substrate's thickness and to a lesser degree on the substrate's permittivity. The degradation in performance is observed for an increased substrate thickness and is explained by the presence of a higher order mode. When the substrate thickness is fixed to a small value and the cutoff frequency of the higher mode is outside the investigated band, there is an optimal permittivity, which offers the best coupler's performance in terms of coupling coefficient, return loss, isolation, and phase difference between the two output ports. In the present investigation, it is found that the best operation is obtained when the substrate's relative permittivity is 4.5 and the substrate thickness of 0.508 mm.
机译：本文介绍了一种椭圆形微带缝耦合器的设计，该耦合器使用了不同厚度和介电常数的基板，旨在在3.0-11.0 GHz频段内工作。 CST Microwave Studio仿真器应用于其设计和性能评估。制作了具有最佳性能的设计以验证调查。已经表明，这种类型的耦合器的宽带工作主要取决于基片的厚度，而在较小程度上取决于基片的介电常数。对于增加的基板厚度，观察到性能下降，并且可以通过存在更高阶模式来解释。当基板厚度固定为一个较小的值并且较高模式的截止频率在研究的频带之外时，存在最佳介电常数，这在耦合系数，回波损耗，隔离度和相位差方面提供了最佳的耦合器性能。在两个输出端口之间。在本研究中，发现当基板的相对介电常数为4.5且基板厚度为0.508 mm时，可获得最佳操作。

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