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Fabrication of superhydrophobic surfaces on interconnected Cu(OH)_2 nanowires via solution-immersion

机译:通过溶液浸泡在互连的Cu(OH)_2纳米线上制备超疏水表面

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摘要

Superhydrophobic surfaces with a contact angle of about 160 deg and a tilt angle lower than 4 deg were fabricated on copper plates via a simple solution-immersion step. Interconnected Cu(OH)_2 nanowires were constructed on the copper surface by immersing copper plates in an aqueous solution of sodium hydroxide and potassium persulfate, and the resulting copper plates exhibited excellent superhydrophilic properties. The copper plates changed their wettability from superhydrophilicity to superhydrophobicity after further chemical modification with dodecanoic acid. The results of this study may pave a new pathway to the fabrication of superhydrophobic surfaces on engineering metals.
机译:通过简单的溶液浸渍步骤,在铜板上制造了具有约160度接触角和小于4度倾斜角的超疏水表面。通过将铜板浸入氢氧化钠和过硫酸钾的水溶液中,在铜表面上构造互连的Cu(OH)_2纳米线,并且所得铜板显示出优异的超亲水性。在用十二烷酸进一步化学改性之后,铜板将其润湿性从超亲水性变为超疏水性。这项研究的结果可能为在工程金属上制造超疏水表面铺平一条新途径。

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