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Synthesis of copper nanoparticles by solid-state plasma-induced dewetting

机译：固态等离子体诱导的去湿法合成铜纳米颗粒

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Copper nanoparticles were prepared by the plasma treatment of Cu thin films without extra heating. The Cu nanoparticles were formed through a solid-state dewetting process at temperatures of less than 450K. The particle sizes, from 10 to 80nm, were controlled by changing the thickness of the Cu film; the particle size increased linearly with the film thickness. The Cu nanoparticles produced by plasma treatment showed an excellent size uniformity compared to those prepared by heat treatment. In the early stage of the dewetting of the Cu film, uniformly distributed holes nucleated, and the holes grew and coalesced until the Cu nanoparticles were formed. The low operating temperatures used contributed to the production of uniform Cu nanoparticles.
机译：铜纳米粒子是通过对Cu薄膜进行等离子处理而制备的，无需额外加热。通过小于450K的温度的固态去湿过程形成Cu纳米颗粒。通过改变Cu膜的厚度来控制10至80nm的颗粒尺寸。粒径随膜厚线性增加。与通过热处理制备的Cu纳米颗粒相比，通过等离子体处理制备的Cu纳米颗粒显示出优异的尺寸均匀性。在Cu膜的去湿的早期，均匀分布的孔成核，并且孔生长并聚结，直到形成Cu纳米颗粒。使用的低操作温度有助于产生均匀的铜纳米颗粒。

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