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首页> 外文期刊>Langmuir: The ACS Journal of Surfaces and Colloids >SELECTIVE CHEMICAL VAPOR DEPOSITION OF PLATINUM AND PALLADIUM DIRECTED BY MONOLAYERS PATTERNED USING MICROCONTACT PRINTING
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SELECTIVE CHEMICAL VAPOR DEPOSITION OF PLATINUM AND PALLADIUM DIRECTED BY MONOLAYERS PATTERNED USING MICROCONTACT PRINTING

机译：微接触印刷单分子膜定向铂和钯的选择性化学气相沉积。

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High-purity platinum and palladium thin films can be deposited selectively by combining microcontact printing (mu CP) and metal-organic chemical vapor deposition (MOCVD). Printed patterns of octadecyltrichlorosilane thin films are used to direct the selective deposition of the metallic thin films from bis(hexafluoroacetylacetonato)platinum(II), Pt(hfac)(2), and bis(hexafluoroacetylacetonato)palladium(II), Pd(hfac)(2), in the presence of hydrogen. This process has been used successfully to fabricate Pt and Pd patterns on substrates such as titanium nitride, indium tin oxide, silicon dioxide, and sapphire. Features with sizes as small as 1.5 mu m have been deposited by this combined mu CP-MOCVD method. The Pt and Pd films were found to be free of detectable impurities, as measured by X-ray photoelectron and Auger electron spectroscopies. Grain sizes in the deposits can also be varied. We found, for example, that the Pt film growth process yields heavily faceted deposits whose habits depend strongly on the temperature of the substrate during processing. Addition of water vapor to the reactor feed during platinum chemical vapor deposition increased the number of nucleation sites, thus reducing the grain size, but did not otherwise affect the deposition rate to a significant degree. We describe in this report how this photolithography-free process might simplify the patterning of metal and other thin films of interest in integrated circuit fabrication. [References: 41]
机译：通过结合微接触印刷（mu CP）和金属有机化学气相沉积（MOCVD），可以选择性地沉积高纯度的铂和钯薄膜。十八烷基三氯硅烷薄膜的印刷图案用于指导从双（六氟乙酰丙酮化）铂（II），Pt（hfac）（2）和双（六氟乙酰丙酮化）钯（II），Pd（hfac）选择性沉积金属薄膜（2）在氢气存在下。该工艺已成功用于在诸如氮化钛，氧化铟锡，二氧化硅和蓝宝石的衬底上制造Pt和Pd图案。通过这种组合式mu CP-MOCVD方法，可以沉积尺寸小至1.5微米的特征。通过X射线光电子和俄歇电子能谱仪测量，发现Pt和Pd膜不含可检测的杂质。沉积物中的晶粒尺寸也可以变化。例如，我们发现Pt膜的生长过程会产生大量刻面沉积，其沉积习惯在很大程度上取决于处理过程中基板的温度。在铂化学气相沉积过程中将水蒸气添加到反应器进料中会增加成核位点的数量，从而减小晶粒尺寸，但不会显着程度地影响沉积速率。我们在这份报告中描述了这种无光刻工艺如何简化集成电路制造中金属和其他感兴趣的薄膜的构图。 [参考：41]

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