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首页> 外文期刊>RSC Advances >AO-resistant shape memory polyimide/silica composites with excellent thermal stability and mechanical properties
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AO-resistant shape memory polyimide/silica composites with excellent thermal stability and mechanical properties

机译：具有优异的热稳定性和机械性能的抗AO形状记忆聚酰亚胺/二氧化硅复合材料

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摘要

Shape memory polyimide/silica (PI/silica) composites with atomic oxygen resistance, good thermal stability and mechanical properties are synthesized by co-condensation of poly(amic acid) terminated with (3-aminopropy)triethoxysilane (APTES) and tetraethoxysliane (TEOS) via a sol-gel method. The silica networks formed in the hybrid films act not only as permanent crosslink points, but as atomic oxygen (AO) resistant moieties. The results show that the PI/silica composite films possess high thermal decomposition temperature (T-d > 550 degrees C), high glass transition temperature (T-g > 265 degrees C) as well as good shape fixation ratio (R-f > 98%) and shape recovery ratio (R-r > 90%). The mechanical properties, surface topography and shape memory performance of PI/silica composite films were evaluated before and after AO irradiation in simulated space environment. Compared to pristine PI, the mechanical properties, surface topography, and shape memory performances of PI-SiO2-15 were less affected by AO exposure, which results from the silica protective layer formed on the composite film surface, indicating good AO-resistant ability of PI/silica composite films. This work may provide a strategy toward the design of promising shape memory materials for applications in the field of severe conditions.
机译：通过（3-氨基丙基）三乙氧基硅烷（APTES）和四乙氧基硅烷（TEOS）封端的聚酰胺酸的共缩合反应，制得具有抗氧原子性，良好的热稳定性和机械性能的形状记忆聚酰亚胺/二氧化硅（PI /二氧化硅）复合材料通过溶胶-凝胶法。在杂化膜中形成的二氧化硅网络不仅充当永久交联点，而且还充当耐原子氧（AO）的部分。结果表明，PI /二氧化硅复合膜具有较高的热分解温度（Td> 550℃），较高的玻璃化转变温度（Tg> 265℃）以及良好的形状固定率（Rf> 98％）和形状恢复性比率（Rr> 90％）。在模拟空间环境中，在AO辐照前后，对PI /二氧化硅复合膜的力学性能，表面形貌和形状记忆性能进行了评估。与原始PI相比，PI-SiO2-15的机械性能，表面形貌和形状记忆性能受AO暴露的影响较小，这是由于在复合膜表面形成了二氧化硅保护层所致，表明其具有良好的抗AO性能。 PI /二氧化硅复合膜。这项工作可以为在恶劣条件下应用的有希望的形状记忆材料的设计提供一种策略。

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