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Complexing agent study via computational chemistry for environmentally friendly silver electrodeposition and the application of a silver deposit

机译：通过计算化学研究络合剂对环境友好的银电沉积及其银沉积的应用

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摘要

In this paper, we introduce a new environmentally friendly silver electroplating bath, employing 5,5-dimethylhydantoin (DMH) and nicotinic acid (NA) as complexing agents, based on the prediction of computational chemistry. An excellent silver electrodeposit with properties suitable for application in electronics packaging was obtained from the newly developed silver electroplating bath, and the electroplating bath is simple and stable. Moreover, the silver(I)complexes in this bath possessed good complex stability. As a consequence, mirror-bright silver electrodeposits on copper substrates with excellent leveling capability, smooth and compact morphologies, high purity and conductivity, as well as excellent welding property could be realized by adopting this unique bath. Based on the performances of the plating bath and silver deposit, the introduced silver plating bath is a promising candidate for silver electrodeposition applied in microelectronics to replace the conventional cyanide silver electroplating baths.
机译：在本文中，我们基于计算化学的预测，介绍了一种新型的环保型银电镀浴，它采用5,5-二甲基乙内酰脲（DMH）和烟酸（NA）作为络合剂。从新开发的银电镀浴中获得了一种具有适合电子封装性能的优良银电沉积物，该电镀浴简单而稳定。此外，该浴中的银（I）配合物具有良好的配合稳定性。结果，通过采用这种独特的镀液，可以在铜基板上获得镜面光亮的银电沉积物，该电沉积物具有出色的流平能力，光滑紧凑的形貌，高纯度和导电性以及出色的焊接性能。基于镀浴和银沉积物的性能，引入的镀银浴是微电子中应用的银电沉积以替代常规氰化物银电镀浴的有希望的候选者。

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