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Technical Director's Corner

机译：技术总监专区

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摘要

The market for the use of high temperature composites, and the resins that support this market, are expected to show as much as a 175 percent growth over the next 7 years (2005-2012) by some predictions. The high temperature resins currently showing interest in this area consist primarily of bismaleimides (BMI) and polyimides (PI). NASA has been conducting extensive studies on their phenylethylnyl terminated imide systems - more often referred to as the "PETI" resins for short. The designations PETI-5, PETI-298, PETI-330 and PETf-375 come to mind as one looks through the SAMPE conference Proceedings. Traditional BMI systems commonly used today are represented by Cytec 5260 and 5270 prepreg and Cytec 5250-4-RTM resin infusion products. The polyimide systems seem a bit more expanded with traditional NASA PMR-15, PMR-II-50, Maverick's DMBZ-15 and AFR-700 materials. Hexcel's HexPly F652 and F655 resin family plus IST's Skybond 700, 703 and 705 series resin systems tend to round out the group. There are also a number of additional materials out there to round out the selection process.
机译：根据一些预测，在未来7年（2005-2012年）中，高温复合材料的使用市场以及支持该市场的树脂预计将增长175％。当前对该领域表现出兴趣的高温树脂主要由双马来酰亚胺（BMI）和聚酰亚胺（PI）组成。美国国家航空航天局（NASA）一直在对其苯乙炔封端的酰亚胺体系进行广泛的研究-简称为“ PETI”树脂。通过SAMPE会议论文集，人们可以想到PETI-5，PETI-298，PETI-330和PETf-375的名称。今天常用的传统BMI系统以Cytec 5260和5270预浸料以及Cytec 5250-4-RTM树脂灌注产品为代表。聚酰亚胺系统似乎在传统的NASA PMR-15，PMR-II-50，Maverick的DMBZ-15和AFR-700材料上得到了更大的扩展。 Hexcel的HexPly F652和F655树脂系列，加上IST的Skybond 700、703和705系列树脂系统，使该组更趋完善。还有很多其他材料可以完善选择过程。

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