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首页> 外文期刊>Soldering & Surface Mount Technology >Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate
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Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate

机译：回流对含Sn-3.8Ag-0.7Cu焊料的Zn纳米颗粒与铜基底之间界面特性的影响

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摘要

Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250℃ for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and spreading rates according to the Japanese Industrial Standard (JIS 23198-3, 2003). The interfacial microstructure of the solder joints were investigated by field emission scanning electron microscope (FESEM) and energy dispersive X-ray spectroscopy (EDAX). Findings - It was found that upon the addition of 0.3 wt% Zn nanoparticles to the SAC solder, the growth of interfacial intermetallic compound (IMC) layers was retarded to a minimum value. Excessive amount of Zn nanoparticles (0.8 wt%) induced an additional IMC layer (Cu_5Zn_8) which increased the total IMC thickness and raising the reliability issue. Originality/value - It is concluded that Zn nanoparticles undergo melting/reaction during reflow and impart their effect on the IMCs through alloying effects.
机译：目的-本文的目的是研究多次回流期间锌（Zn）纳米粒子对Sn-3.8Ag-0.7Cu（SAC）焊料和Cu基底之间的界面金属间化合物（IMC）的影响。设计/方法/方法-通过将SAC焊膏与不同数量的Zn纳米颗粒手动混合来制备纳米复合焊料。锡膏在250℃的热板上回流45 s，最多可重复六次。回流后的实际锌含量通过电感耦合等离子体发射光谱法（ICP-OES）进行分析。通过根据日本工业标准（JIS 23198-3，2003）分析接触角和铺展速率来表征焊料的润湿行为。通过场发射扫描电子显微镜（FESEM）和能量色散X射线光谱仪（EDAX）研究了焊点的界面微观结构。发现-发现在SAC焊料中添加0.3 wt％的Zn纳米颗粒后，界面金属间化合物（IMC）层的生长被抑制到最小值。过量的锌纳米颗粒（0.8 wt％）会导致额外的IMC层（Cu_5Zn_8），这会增加IMC的总厚度并增加可靠性问题。原创性/价值-结论是，纳米锌颗粒在回流过程中会发生熔化/反应，并通过合金化作用将其作用于IMC。

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