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首页> 外文期刊>Soldering & Surface Mount Technology >Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste
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Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

机译：烧结纳米银浆粘结的三明治组件在热循环下的曲率演变

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Purpose - The purpose of this paper is to determine: how much the residual curvature could be formed in sintered nano-silver assembly when it is cooled to room temperature from the sintering temperature (normally 275℃); how the cyclic temperature load affects the residual curvature or stresses in sintered joint. Then the stress level and the reliability of sintered nano-silver for high-temperature applications can be understood. Design/methodology/approach - 5 mm * 2.5 mm silicon chip was bonded with 96 per cent Al_2O_3 substrate by sintering nanosilver paste. An optical system was developed to measure the curvature of the sintered assemblies. Reliability of the sintered assemblies was evaluated by temperature cycling of -40～125℃. Finite element analysis was employed to simulate the behavior of the joint subjected to the temperature cycling from -40℃ to 125℃ by ANSYS. SEM images were taken to investigate the impact of temperature cycling on the reliability of sintered silver attachment. Findings - This residual bending at room temperature was found concave towards the substrate (alumina) side. Also, with the bondline thickness increasing, the residual curvature decreases obviously. The severity of the residual bending in all the structures was mitigated to some extent with increasing number of cycles. There is no crack in the joint with the thickness of 25μm. The drop of the residual curvature of the samples with bondline of 25 mm is caused mainly by stress relaxation in sintered silver before 300 cycles. Sample with thicker bondline is more susceptible to thermal cycling for the structure bonded with nanosilver than that with thinner bondline. The poor quality of bonding is due to the thicker sintered joint, which means that sintered nanosilver is not suitable for die-attachment requiring thick bondline. Originality/value - The paper describes: how a precise optical system was developed to measure the residual curvature of the sintered assemblies; how the evolution of the residual curvature of the sintered assembly with the temperature cycling was obtained by both experiment and simulation; and how microstructures of the sintered silver joint were analyzed for as-sintered assembly and the sintered assembly after temperature cycling.
机译：目的-本文的目的是确定：从烧结温度（通常为275℃）冷却至室温时，烧结纳米银组件中会形成多少残余曲率;循环温度负荷如何影响烧结接头的残余曲率或应力。然后可以了解高温应用下烧结纳米银的应力水平和可靠性。设计/方法/方法-通过烧结纳米银浆，将5 mm * 2.5 mm的硅芯片与96％的Al_2O_3衬底粘合在一起。开发了光学系统以测量烧结组件的曲率。通过-40〜125℃的温度循环评价烧结组件的可靠性。通过有限元分析，利用ANSYS软件模拟了在-40℃至125℃的温度循环下接头的行为。拍摄SEM图像以研究温度循环对烧结银附件可靠性的影响。发现-在室温下发现该残余弯曲向基板（氧化铝）侧凹入。而且，随着粘结层厚度的增加，残余曲率明显降低。随着循环次数的增加，所有结构中残余弯曲的严重程度有所减轻。厚度为25μm的接头处无裂纹。粘结线为25 mm的样品的残余曲率下降主要是由于300次循环之前烧结银中的应力松弛引起的。粘结线较厚的样品比粘结线较薄的样品更容易受到热循环的影响。粘结质量差是由于烧结接头较厚，这意味着烧结纳米银不适用于需要较厚粘结层的管芯连接。原创性/价值-本文描述：如何开发一种精确的光学系统来测量烧结组件的残余曲率;通过实验和模拟如何获得烧结组件的残余曲率随温度循环的变化;以及如何分析烧结银接头和烧结后温度循环后的烧结银接头的微观结构。

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