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首页> 外文期刊>Soldering & Surface Mount Technology >Correlation between jamming and skipping during solder paste printing
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Correlation between jamming and skipping during solder paste printing

机译：锡膏印刷过程中卡纸和跳纸之间的关系

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Purpose - To investigate how jamming of particles in a solder paste varies as a function of the gap through which the particles flow, and to correlate this with skipping defects during the printing process. Design/methodology/approach - Solder pastes with particle sizes of types 2, 3, 4 and 5 were sheared between the parallel plates of a rheometer. Jamming events that cause the solder particles to be forced against each other were detected by monitoring the electrical current flowing between the plates under a bias of 1.0V or less. Solder paste printing trials were conducted with the same pastes, and solder paste skipping monitored. Findings - Jamming was detected when the ratio of plate gap to largest particle diameter is reduced to a value between 3.8 and 5.0. Decreasing the gap further results in increased jamming. A strong correlation between levels of skipping and jamming was found. Research limitations/implications - More extensive printing trials are required before rheometric jamming detection can be used to predict printing performance. Practical implications - The common rule of thumb used in solder paste printing that the aperture width should be no smaller than 4-5 particle diameters is justified. Originality/value - This paper presents a new technique for detecting jamming events which are too brief to be detected using normal rheometric techniques, but which have long been thought to be responsible for stochastic skipping defects during printing. Evidence supporting the link between jamming and this type of defect is presented.
机译：目的-研究焊膏中的颗粒堵塞如何随颗粒流过的间隙而变化，并将其与印刷过程中跳过的缺陷相关联。设计/方法/方法-将粒度为2、3、4和5型的焊膏剪切在流变仪的平行板之间。通过监视在1.0V或更低的偏压下在板之间流动的电流，可以检测到导致焊料颗粒相互挤压的干扰事件。使用相同的锡膏进行锡膏印刷试验，并监测锡膏跳跃情况。发现-当板间隙与最大粒径的比率降低到3.8和5.0之间的值时，检测到卡纸。减小间隙会进一步导致卡纸。发现跳跃和卡纸的水平之间有很强的相关性。研究的局限性/意义-流变堵塞检测可用于预测印刷性能之前，需要进行更广泛的印刷试验。实际意义-在焊膏印刷中使用的通用经验法则是，孔径宽度应不小于4-5粒径是合理的。原创性/价值-本文提出了一种新的技术，用于检测卡纸事件，这些事件太短了，无法使用常规流变仪技术检测到，但长期以来一直被认为是造成打印过程中随机跳过缺陷的原因。提出了支持干扰与此类缺陷之间联系的证据。

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