Mechanical stress and deformation of SMT components during temperature cycling and PCB bending

Riner W. Kuhl

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Mechanical stress and deformation of SMT components during temperature cycling and PCB bending

机译：SMT组件在温度循环和PCB弯曲过程中的机械应力和变形

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A very common method to predict the reliability of components soldered on printed circuit board (PCB) or substrates is by bending tests and temperature cycle tests, for instance between-55℃ and 125℃ (up to 2,000 cycles at 1h cycle period).Sensitive SMD constructions such as chips with ball grid array mounting or multilayer chip capacitors (MLCC) are often a major issue due to their flex cracking" problems. This paper describes the real behaviour of deformation at temperature cycling andPCB bending of chip components (body size 0603). By using the piezoresistive effect in thick film resistors the effects of stress on the alumina body can be determined end described for the whole temperature range of Interest. The complete system ofcomponent, PCS/substrate and solder joint will be discussed and different influences will be isolated. It will be shown that CTE-matching of the component and substrate does opt lead to an optimum situation. The influence of the solder joint plays animportant part. Optimization potentials and design rules for the whole system will be given. The basis of this paper is a quite unusual "measurement tool", the effect of piezoresistivity. The investigation Into that phenomenon will be described verythoroughly first.

机译：预测焊接在印刷电路板（PCB）或基板上的组件可靠性的一种非常常见的方法是通过弯曲测试和温度循环测试，例如-55℃至125℃（在1h循环周期内最多2,000个循环）。诸如带有球栅阵列安装的芯片或多层芯片电容器（MLCC）之类的SMD结构通常会由于“挠曲裂纹”问题而成为一个主要问题。本文介绍了温度循环变形的实际行为以及芯片组件（主体尺寸为0603）的PCB弯曲）。通过在厚膜电阻器中使用压阻效应，可以确定在整个目标温度范围内对氧化铝体的应力影响，并讨论了组件，PCS /基板和焊点的完整系统，并将讨论不同的影响可以看出，元件和基板的CTE匹配确实会导致最佳情况，焊点的影响至关重要部分。将给出整个系统的优化潜力和设计规则。本文的基础是一个非常不寻常的“测量工具”，即压阻效应。首先将彻底描述对该现象的研究。

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来源
《Soldering & Surface Mount Technology》 |1999年第2期|共7页
作者
Riner W. Kuhl;
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正文语种 eng
中图分类焊接一般性问题;
关键词
Bending behaviour; Components; Printed circuit boards; Stress; Temperature cycling;

机译：弯曲行为;组件;印刷电路板;应力;温度循环;

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1. Mechanical stress and deformation of SMT components during temperature cycling and PCB bending [J] . Riner W. Kuhl Soldering & Surface Mount Technology . 1999,第2期

机译：SMT组件在温度循环和PCB弯曲过程中的机械应力和变形
2. Effects of degrees of deformation and stress-relief temperatures on the mechanical properties and residual stresses of cold drawn mild steel rods [J] . A. J. Alawode, M. B. Adeyemi Journal of Materials Processing Technology . 2005,第2期

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3. Finite element analysis of temperature induced stresses and deformations of polymer composite components [J] . J. Wang, D. Kelly, W. Hillier Journal of Composite Materials . 2000,第17期

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4. Thermo-mechanical investigation of the reliability of embedded components in PCBs during processing and under bending loading [C] . Atli-Veltin Bilim, Huang Ling, Susan Zhao, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on . 2012

机译：在加工过程中和弯曲载荷下PCB中嵌入式组件可靠性的热力学研究
5. Reliability of electro-mechanical components subject to on/off cycling and continuous operation under multiple stresses. [D] . Teng, Niann-Hwa. 1988

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Mechanical stress and deformation of SMT components during temperature cycling and PCB bending

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