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Electrical conductivity of polyaniline-dodecylbenzene sulphonic acid complex: thermal degradation and its mechanism

机译:聚苯胺-十二烷基苯磺酸配合物的电导率:热降解及其机理

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摘要

Polyaniline (PANI) doped with dodecylbenzene sulphonic acid (DBSA) and methylbenzene sulphonic acid (MBSA) were used as model compounds to investigate thermal degradation mechanisms of electrical conductivity of PANI salts. The effects of high temperature annealing on the conductivity, thermal stability and morphology of the doped PANI were studied. Within a period of 2 h the conductivity of the two PANI salts decreases continuously with the annealing time. The conductivity reduction also increases significantly with the annealing temperature. Both polymers show significant weight loss during the annealing especially at 200 deg C. The weight loss of PANI-MBSA is more pronounced than that of PANI-DBSA while the conductivity reduction shows an opposite trend. Scanning electronic microscopy (SEM) study reveals a significant morphology change caused by the annealing. Fourier transformed infrared (FT-IR) results indicate that some dopants are converted to free acids due to the annealing. It is, therefore, suggested that in addition to cross-linking of PANI and evaporation and degradation of the dopants, the segregation of the dopants from the polymers is also an important mechanism responsible for the conductivity degradation observed.
机译:以十二烷基苯磺酸(DBSA)和甲基苯磺酸(MBSA)掺杂的聚苯胺(PANI)为模型化合物,研究了PANI盐电导率的热降解机理。研究了高温退火对掺杂PANI的电导率,热稳定性和形貌的影响。在2小时内,两种PANI盐的电导率随退火时间连续降低。电导率的降低也随着退火温度的增加而显着增加。两种聚合物在退火过程中都表现出明显的重量损失,尤其是在200摄氏度时。PANI-MBSA的重量损失比PANI-DBSA的重量损失更为明显,而电导率的下降却显示出相反的趋势。扫描电子显微镜(SEM)研究表明,退火引起了显着的形态变化。傅立叶变换红外(FT-IR)结果表明,由于退火,一些掺杂剂转化为游离酸。因此,建议除了PANI的交联以及掺杂剂的蒸发和降解之外,掺杂剂从聚合物中的分离也是导致观察到的电导率降低的重要机理。

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