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Two different types of shear-deformation behaviour in Au-Cu multilayers

机译:铜铜多层板中两种不同类型的剪切变形行为

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摘要

Localised shear deformation of a material is usually identified as a particular feature of deformation inhomogeneity. Here, we show two different types of shear deformation-behaviour that occurred in Au-Cu multilayers subjected to microindentation load, namely, a cooperative-layer-buckling-induced shear banding in a nanoscale multilayer and a direct localised shearing across a layer interface along a shear plane in a submicron-scale multilayer. Theoretical analysis indicates that the formation of the two different types of shear deformation in the multilayers depends on a competition between the dislocation-pile-up-induced stress concentration at the layer interface and the barrier strength of the layer interface for glissile dislocation transmission.
机译:通常将材料的局部剪切变形识别为变形不均匀性的特定特征。在这里,我们显示了两种不同类型的剪切变形行为,它们发生在承受微压痕载荷的金铜多层中,即纳米级多层中的协同层屈曲诱发的剪切带和沿层界面沿层的直接局部剪切亚微米级多层中的剪切平面。理论分析表明,在多层体中两种不同类型的剪切变形的形成取决于层间界面处的位错-堆积-诱导应力集中与层间界面的阻挡力之间的竞争。

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