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Properties of silicon-based ceramics produced by hot isostatic pressing ultrafine powders

机译:热等静压超细粉末生产的硅基陶瓷的性能

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The densification of ultrafine laser-synthesized SiC (below 20 nm) and of mixtures of ultrafine SiSiC with conventional carbon powders has been performed by encapsulated hot isostatic pressing (HIP). Density and grain size as functions of temperature, HIP pressure, additive content and porosity distribution of the green body are discussed for the case of poor SIC samples. The results of measurements of thermomechanical properties and the influence of the grain size are presented. Hardness shows a significant increase with decreasing grain size, especially in specimens with a high density. Hot hardness measurements up to 1100 degrees C on a specimen with a grain size of about 300 nm revealed a relatively high hardness level compared with conventional SiC ceramics in the intermediate temperature range. Indentation fracture toughness slightly decreased with decreasing grain size. Thermal conductivity of the fine-grained SiC-based samples are lower than the values of conventional SiC ceramics, indicating the influence of the fine grain size on the phonon scattering. Measurements at temperatures up to 1500 degrees C reveal that the reduction in the thermal conductivity in fine-grained SiC is significantly reduced at higher temperatures.
机译:超细激光合成SiC(20 nm以下)以及超细SiSiC与常规碳粉混合物的致密化已通过封装热等静压(HIP)进行。对于差的SIC样品,讨论了密度和晶粒度随温度,HIP压力,添加剂含量和生坯孔隙率函数的变化。给出了热机械性能的测量结果以及晶粒尺寸的影响。硬度随着晶粒尺寸的减小而显着增加,尤其是在高密度试样中。在中等温度范围内,与常规SiC陶瓷相比,在晶粒尺寸约为300 nm的样品上进行高达1100摄氏度的热硬度测量显示出相对较高的硬度水平。压痕断裂韧性随着晶粒尺寸的减小而略微降低。细粒SiC基样品的热导率低于常规SiC陶瓷的值,表明细粒度对声子散射的影响。在高达1500摄氏度的温度下进行的测量表明,在较高的温度下,细晶粒SiC的热导率降低明显降低。

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